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Development of “New Abrasive-Free Copper CMP Solutions” BASED on Electrochemical and Film Analysis Method

Published online by Cambridge University Press:  01 February 2011

Jin Amanokura ,
Yasuo Kamigata ,
Masanobu Habiro ,
Hiroshi Suzuki  and
Masanobu Hanazono
Jin Amanokura
Affiliation:
Semiconductor Materials Div., Yamazaki Works, Hitachi Chemical Co. Ltd., Ibaraki, Japan
Yasuo Kamigata
Affiliation:
Semiconductor Materials Div., Yamazaki Works, Hitachi Chemical Co. Ltd., Ibaraki, Japan
Masanobu Habiro
Affiliation:
Semiconductor Materials Div., Yamazaki Works, Hitachi Chemical Co. Ltd., Ibaraki, Japan
Hiroshi Suzuki
Affiliation:
Semiconductor Materials Div., Yamazaki Works, Hitachi Chemical Co. Ltd., Ibaraki, Japan
Masanobu Hanazono
Affiliation:
Semiconductor Materials Div., Yamazaki Works, Hitachi Chemical Co. Ltd., Ibaraki, Japan
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Abstract

Abrasive-free Cu CMP solutions have been developed to reduce micro-scratches and obtain minimized dishing and erosion properties. During the development of the solutions, some electrochemical examinations were performed. One of the most instructive knowledge was obtained through the Tafel plot. Other attractive data were obtained through Cu complex film analysis. On the basis of these studies were developed and released newly formulated abrasive-free Cu CMP solutions with a high Cu removal rate and excellent topography performance. Mechanism of polishing by applying abrasive-free Cu CMP solutions is also discussed in this paper.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 732: Symposium I – Chemical-Mechanical Planarization , 2002 , I1.2
Copyright
Copyright © Materials Research Society 2002

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