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The Determination of Mechanical Parameters and Residual Stresses for Thin Films Using Micro-Cantilever Beams

Published online by Cambridge University Press:  22 February 2011

S. Hong ,
T. P. Weihs ,
J. C. Bravman  and
W. D. Nix
S. Hong
Affiliation:
Dept. of Materials Science and Engineering, Stanford University, Stanford, CA. 94305
T. P. Weihs
Affiliation:
Dept. of Materials Science and Engineering, Stanford University, Stanford, CA. 94305
J. C. Bravman
Affiliation:
Dept. of Materials Science and Engineering, Stanford University, Stanford, CA. 94305
W. D. Nix
Affiliation:
Dept. of Materials Science and Engineering, Stanford University, Stanford, CA. 94305
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Abstract

A method for determining mechanical parameters and residual stresses for thin films is described. Multi-layer cantilever beams (LPCVD SiNx/thermal SiO2) are fabricated utilizing standard IC processing technologies and micromachining of silicon. The elastic response of the beams to imposed deflections is then measured using a Nanoindenter, a sub-micron hardness testing machine. The elastic constants of the nitride films are calculated from the force vs. deflection slope and known elastic constants of the thermal SiO2 and silicon. By measuring the curvature of the multi-layer cantilever beams with a scanning electron microscope after successive etching of the LPCVD nitride films, average and differential stresses in the films were calculated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 130: Symposium C – Thin Films: Stresses and Mechanical Properties I , 1988 , 93
Copyright
Copyright © Materials Research Society 1989

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References

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