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Corrosion Behaviour of Aluminum Metallization During Aqueous Exposure

Published online by Cambridge University Press:  21 February 2011

Y. C. Koo ,
T. L. Walzak  and
R. D. Davidson
Y. C. Koo
Affiliation:
Surface Science Western, Western Science Centre, The University of Western Ontario, London, Ontario, N6A 5B7Canada
T. L. Walzak
Affiliation:
Office of Research Services, Stevenson-Lawson Building, The University of Western Ontario, London, Ontario, N6A 58BCanada
R. D. Davidson
Affiliation:
Surface Science Western, Western Science Centre, The University of Western Ontario, London, Ontario, N6A 5B7Canada
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Abstract

It is known that aluminum will readily form aluminum hydroxide during aqueous exposures. Thick oxide layers with a typical pseudoboehmite (fibre-like network) structure and bayerite crystals were observed on the aluminum metallization after the aqueous cleaning process. The study investigated the effect of a deionized (DI) water cleaning process (recently implemented to replace CFC-based cleaning technology) on the surface chemistry and corrosion behaviour of aluminum wire bond pads. The study also correlated the wire bond yield and oxide thickness with various water cleaning process parameters. The wire bond yield and reliability issues are discussed briefly.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 123
Copyright
Copyright © Materials Research Society 1995

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References

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