Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-25T15:27:42.743Z Has data issue: false hasContentIssue false
  • English
  • Français

Comparison of Carbon-based Nanostructures with Commercial Products as Thermal Interface Materials

Published online by Cambridge University Press:  31 January 2011

Michael Rosshirt ,
Drazen Fabris ,
Christopher Cardenas ,
Patrick Wilhite ,
Thanh Tu  and
Cary Y. Yang
Michael Rosshirt
Affiliation:
[email protected], Center for Nanostructures Santa Clara University, Santa Clara, California, United States
Drazen Fabris
Affiliation:
[email protected], Center for Nanostructures Santa Clara University, Santa Clara, California, United States
Christopher Cardenas
Affiliation:
[email protected], Center for Nanostructures Santa Clara University, Santa Clara, California, United States
Patrick Wilhite
Affiliation:
[email protected], Center for Nanostructures Santa Clara University, Santa Clara, California, United States
Thanh Tu
Affiliation:
[email protected], Center for Nanostructures Santa Clara University, Santa Clara, California, United States
Cary Y. Yang
Affiliation:
[email protected], Center for Nanostructures Santa Clara University, Santa Clara, California, United States
Get access

Abstract

Heat dissipation in electronics packaging can be highly dependent on Thermal Interface Materials (TIM). TIM contact, compliance, and conductivity can be the dominant limiting factors in the overall conduction heat transfer across the interface. Mixing multiwall Carbon Nanotubes (CNTs), which have high thermal conductivity, with other thermally conducting materials holds great promise as TIM fillers and has been shown to have higher thermal performance than commercial TIM ‘1’. Such mixtures possess greater thermal conductivity as a result of increased thermal conduction paths through highly conductive, high aspect ratio CNTs.

In this work, we develop and test an advanced apparatus based on the ASTM D5470-06 standard to measure thermal interface resistance. Our experimental findings quantify the thermal performance trends of industry-standard TIM Arctic Silver® 5 along with hybrid TIM mixtures of Arctic Silver®5 and varying weight ratios of CNTs. Early experimental findings show that Arctic Silver®5 mixed with 0.5 to 1% multiwall CNT by weight may improve thermal conductivity over pure Arctic Silver®5.The goal of this research is to investigate the viability of integrating CNTs with commercial products as improved TIM for electronic cooling in chip packages.

Keywords

thermal conductivitypackagingnanoscale
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1158: Symposium F – Packaging, Chip-Package Interactions and Solder Materials Challenges , 2009 , 1158-F03-03
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Ngo, Q. Cruden, B.A. Cassell, A.M. Sims, G. Meyyappan, M. Li, J. and Yang, C.Y. “Thermal Interface Properties of Cu-filled Vertically Aligned Carbon Nanofiber Arrays,” Nano Letters 4, 2403–2407. (2004).Google Scholar
[2] Incropera, F.P. Dewitt, D.P. Bergman, T.L. Lavine, A.S. Fundamentals of Heat and Mass Transfer 6th Edition (John Wiley & Sons Inc., New Jersey, 2007) pp101–103.Google Scholar
[3] Gwinn, J.P., Webb, R.L. “Performance and testing of thermal interface materials,” Microelectronics Journal 34, 215–222. (2003)Google Scholar
[4] Aradhya, S.V. Garimella, S.V. Fisher, T.S. “Electrothermally bonded carbon nanotubes interfaces,” Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2008, pp 1071–1077.Google Scholar
[5] Goel, N. Anoop, T.K. Bhattacharya, A. et al. , “Technical review of characterization methods for thermal interface materials (TIM),” Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2008, pp. 248–258.Google Scholar
[6] Berber, S. Kwon, Y.K. Tomanek, D. “Unusually high thermal conductivity of carbon nanotubes,” Physical Review Letters, 84, 4613–4616, 2000.Google Scholar
[7] Zhao, Y. et al. , “Interfacial energy and strength of multiwalled-carbon-nanotube-based dry adhesive,” Journal of Vacuum Science and Technology B 24, 331–335, (2006).Google Scholar
[8] American Society for Testing and Materials, ASTM Standard D5470-06, “Standard Test Method for Thermal Transmission Properties of Thermally Electrical Insulation Materials,” 2006.Google Scholar
[9] Jackson, R.L. Bhavnani, S.H. Ferguson, T.P. “A Multiscale Model of Thermal Contact Resistance between Rough Surfaces,” J. of Heat Transfer 130, 1–8, (2008).Google Scholar
[10] Mikic, B.B. “Thermal contact conductance: Theoretical considerations,” Int. J. of Heat Transfer 17, 205–214, (1974).Google Scholar
[11] Antonetti, V.W. T. Whittle, D. R. Simons, E. “An approximate thermal contact conductance correlation,” Experimental/Numerical Heat Transfer Combust, Phase Change, 170, 35–42, (1991).Google Scholar
[12] Arctic Silver® 5 High Density Polysynthetic Silver Thermal Compound, Specifications. http://www.arcticsilver.com/as5.htmGoogle Scholar
[13] Narumanchi, S. Mihalic, M. Kelly, K. NREL, “Thermal Interface Materials for Power Electronics Applications,” Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2008, pp. 395–404, (2008).Google Scholar