Hostname: page-component-cd9895bd7-dzt6s Total loading time: 0 Render date: 2024-12-27T01:37:30.701Z Has data issue: false hasContentIssue false
  • English
  • Français

Comparative Analysis of the Nucleation and Growth of Copper on Different Low-k Polymers

Published online by Cambridge University Press:  17 March 2011

V. Zaporojtchenko ,
J. Erichsen ,
T. Strunskus ,
K. Behnke ,
F. Faupel ,
M. Baklanov  and
K. Maex
V. Zaporojtchenko
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
J. Erichsen
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
T. Strunskus
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
K. Behnke
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
F. Faupel
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
M. Baklanov
Affiliation:
2 IMEC, Leuven, Belgium
K. Maex
Affiliation:
2 IMEC, Leuven, Belgium
Get access

Abstract

In this work we present investigations of the nucleation and growth of evaporated copper on several low-k polymers. The evolving interfaces were characterized using transmission electron microscopy (TEM), x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results were compared between the PMDA/ODA polyimide, Teflon AF 1601 and Silk®. A diffusion coefficient for copper atoms in Silk® determined by low energy ion-beam depth profiling in conjunction with XPS is reported.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 714: Symposium – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics II , 2001 , L8.1.1
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ho, P.S., Haight, R., White, R.C., Silverman, B.D., Faupel, F., Chemistry, micro-structure and adhesion of metal/polymer interfaces, in: Lee, L.H., ed., Fundamentals of Adhesion, Plenum Press, New York, 1991, 383–406 Google Scholar
2. Faupel, F., Strunskus, T., Kiene, M., Thran, A., Bechtolsheim, C.v., Zaporojtchenko, V., Fundamental Aspects of Polymer Metallization, in: Mat. Res. Soc. Symp. Proc. 511, 1998, 15–26 Google Scholar
3. Faupel, F., Willecke, R., Thran, A., Mater. Sci. Eng. R 22, 1 (1998)Google Scholar
4. Zaporojtchenko, V., Behnke, K., Strunskus, T., Faupel, F., Surf. Interf. Anal., 30, 439–443 (2000)Google Scholar
5. Thran, A., Kiene, M., Zaporojtchenko, V., Faupel, F., Phys. Rev. Lett., 82, 1999, 1903 Google Scholar
6. Martin, S.J., Godschalx, J. P, Mils, M.E., Shaffer, E. O. II, Townsend, P.H., Adv. Mater. 2000, 12, 1769 Google Scholar
7. Zaporojtchenko, V.; Strunskus, T.; Behnke, K.; Bechtolsheim, C.v.; Thran, A.; Faupel, F., Microelectronic engineering 50, 465–472 (2000)Google Scholar
8. , Rajagopal, Gregoire, C., Lemarie, J.J., Piereaux, J.J., Baklanov, M.R., Maex, K., WaeterlosJ, J.J.. Vac. Sci. Technol. B17(5), 1999, 2336 Google Scholar
9. Venabbles, J.A., Surf. Sci., 299–300 (1994), 7989. D. Popovici, K. Piyakis, M. Meunier, E. Sacher; J. Appl. Phys. 83 (1), 1998, 108Google Scholar
10. Kiene, M., Strunskus, T., Peter, R., Faupel, F., Adv. Mat., 10, 1998, 1357 Google Scholar