Hostname: page-component-cd9895bd7-gbm5v Total loading time: 0 Render date: 2024-12-27T02:24:11.937Z Has data issue: false hasContentIssue false
  • English
  • Français

Combining X-Ray Diffraction and Substrate Deflection Analysis to Understand Internal Stress in Electroless Copper Films

Published online by Cambridge University Press:  07 January 2013

Tanu Sharma ,
Ralf Brüning ,
Delilah A. Brown ,
Simon Bamberg ,
Michael Merschky  and
Frank Brüning
Tanu Sharma
Affiliation:
Physics Department, Mount Allison University, Sackville NB, Canada E4L 1E6
Ralf Brüning
Affiliation:
Physics Department, Mount Allison University, Sackville NB, Canada E4L 1E6
Delilah A. Brown
Affiliation:
Physics Department, Mount Allison University, Sackville NB, Canada E4L 1E6
Simon Bamberg
Affiliation:
Atotech Deutschland GmbH, Erasmusstrasse 20, D-10553 Berlin, Germany Department of Chemistry, Chemical Engineering Division, Technical University Berlin, Strassedes 17. Juni 124, 10623 Berlin, Germany
Michael Merschky
Affiliation:
Department of Chemistry, Chemical Engineering Division, Technical University Berlin, Strassedes 17. Juni 124, 10623 Berlin, Germany
Frank Brüning
Affiliation:
Department of Chemistry, Chemical Engineering Division, Technical University Berlin, Strassedes 17. Juni 124, 10623 Berlin, Germany
Get access

Abstract

Electroless copper films are usually the first conducting layer on the insulating substrates of printed circuit boards. For this and other emerging applications, the internal stress of the copper layer is an important consideration both for film adhesion and film-substrate interaction. We have combined stress/strain analysis based on X-ray diffraction, which is sensitive to the strain of the copper crystallites, with a conventionally used technique that analyses the bending of the substrate (Deposit Stress Analyzer). Both techniques were implemented in such a way that the stress could be monitored continuously during the deposition of the films from the electroless plating bath as well as afterwards. These tests were carried out for three chemical formulations and the results from both techniques agree qualitatively. For one bath, the substrate bending method detects a 60 nm region of local stress at the film-surface interface.

Keywords

Cuadhesionstress/strain relationship
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1529: Symposium WW – Roll-to-Roll Processing of Electronics and Advanced Functionalities , 2012 , mrsf12-1529-ww08-07
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Huang, Y., Chen, J., Yin, Z. and Xiong, Y., IEEE Trans. Compon. Packag. Manuf. Technol. 1 (7), 1368 (2011).CrossRefGoogle Scholar
Patton, N., APEX Proc. Electronic Circuits World Convention (ECWC) 10, S29–2 (2005).Google Scholar
Kenny, S., Magaya, T. and Palanzola, M., Proc. IPC APEX EXPO Technical Conference S01_01 (2010).Google Scholar
Brüning, R., Muir, B., McCalla, E., Lempereur, E.M., Brüning, F. and Etzkorn, J., Thin Solid Films 519, 4377 (2011).CrossRefGoogle Scholar
Brüning, R., Perry, L.K., Muir, B., Abuzir, A., Bamberg, S., Friz, W., Dambrowsky, N. and Brüning, F., Mater. Res. Soc. Symp. Proc. Vol. 1400 (2012) DOI: 10.1557/opl.2012.92.CrossRefGoogle Scholar
Shacham-Diamand, Y., Dubin, V., Angyal, M., Thin Solid Films 262, 93 (1995).CrossRefGoogle Scholar
Bamberg, S., Perry, L.K., Muir, B., Abuzir, A., Brüning, F., and Brüning, R., Thin Solid Films 520, 6935 (2012).CrossRefGoogle Scholar
Chason, E., Sheldon, B.W., Freund, L.B., Floro, J.A. and Hearne, S.J., Phys. Rev. Let. 88, 156103 (2002).¸ CrossRefGoogle Scholar
Nix, W.D. and Clemens, B.M., J. Mater. Res. 14, 3467 (1999).CrossRefGoogle Scholar