Hostname: page-component-cd9895bd7-fscjk Total loading time: 0 Render date: 2024-12-27T01:34:01.866Z Has data issue: false hasContentIssue false
  • English
  • Français

An Alternative Non-contact Planarization Technique by Utilizing the Electrokinetic Phenomenon

Published online by Cambridge University Press:  01 February 2011

David Butler ,
Cheng Seng Leo ,
Sum Huan Ng  and
Steven Danyluk
David Butler
Affiliation:
[email protected], Nanyang Technological University, Singapore, Singapore
Cheng Seng Leo
Affiliation:
[email protected], Singapore Institute of Manufacturing Technology, Singapore, Singapore
Sum Huan Ng
Affiliation:
[email protected], Nanyang Technological University, School of Mechanical & Aerospace Engineering, 50 Nanyang Avenue, Singapore, 639798, Singapore
Steven Danyluk
Affiliation:
[email protected], Georgia Institute of Technology, Singapore, Singapore
Get access

Abstract

In this paper, the authors introduce and present some findings on an alternative non-contact material removal technique. Material removal is made possible by utilizing the electrokinetic and hydrodynamic effects of suspended particles to manipulate their trajectories to impact onto the surface of the workpiece. The research was previously demonstrated and reported where the removal rate can be precisely controlled by varying the electrical field and the flow rate of the slurry across the surface of the workpiece. New findings are reported on the application of the technique to different materials that will highlight the attractiveness of this alternative approach to producing surfaces with roughness in the order of nanometres.

Keywords

nanoscalemachiningslurry
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1249: Symposia E/F – Advanced Interconnects and Chemical Mechanical Planarization for Micro-and Nanoelectronics , 2010 , 1249-E05-03
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Jain, V.K. Machining Science and Technology 12 (3), 257–294 (2008).Google Scholar
2 Murata, R. Okano, K. and Tsutsumi, C. in Proceedings of the Milton C. Shaw Grinding Symposium, (PED 16, 1985) pp. 261–272.Google Scholar
3 Ohmori, H. Nakagawa, T. Annals of the CIRP 39 (1), 329–332 (1990).Google Scholar
4 Geddam, A. and Noble, C.F. International Journal of Machine Tool Design and Research 11 (1), 1–12 (1971).Google Scholar
5 Leo, C.S. Blackburn, T.L. Ng, S.H. Yang, C. Butler, D.L. and Danyluk, S. in Device and Process Technologies for Microelectronics, MEMS, Photonics and Nanotechnology IV, edited by Tan, H. H. Chiao, J. C. Faraone, L. Jagadish, C. Williams, J. and Wilson, A. R. (Proc. of SPIE Vol. 6800, 680028, 2008) pp. 1-10.Google Scholar
6 Whitesides, G.M. Nature 442 (7101), 368–373 (2006).Google Scholar
7 Hunter, R.J. in Zeta Potential in Colloid Science: Principle and Applications, (Academic Press, London, 1980).Google Scholar