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Viscoelastic Characterization of an Epoxy-Based Molding Compound

Published online by Cambridge University Press:  21 February 2011

V. H. Kenner ,
M. R. Julian ,
C. H. Popelar  and
M. K. Chengalva
V. H. Kenner
Affiliation:
Department of Aerospace Engineering, Applied Mechanics and Aviation, The Ohio State University, Columbus, OH 43210
M. R. Julian
Affiliation:
Department of Aerospace Engineering, Applied Mechanics and Aviation, The Ohio State University, Columbus, OH 43210
C. H. Popelar
Affiliation:
Department of Aerospace Engineering, Applied Mechanics and Aviation, The Ohio State University, Columbus, OH 43210
M. K. Chengalva
Affiliation:
Department of Aerospace Engineering, Applied Mechanics and Aviation, The Ohio State University, Columbus, OH 43210
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Abstract

This paper describes the viscoelastic characterization of a highly filled epoxy molding compound commonly used in electronic packaging applications. Both stress relaxation tests and constant strain rate tensile tests were conducted. The material was found to be nonlinear in its viscoelastic behavior and to be amenable to horizontal shifting to form master curves. A representation of the master stress relaxation curves in terms of a Prony series is given, and the use of this representation illustrated in the context of both linear and nonlinear representations of the viscoelastic behavior to predict the results of the constant strain rate experiments.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 97
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. Julian, M.R., M.S. thesis, The Ohio State University, 1994.Google Scholar
2. Kenner, V.H., Knauss, W.G. and Chai, H., Exp. Mech. 22 (2), 75–80 (1982).Google Scholar
3. Ferry, J.D., Viscoelastic Properties of Polymers (Wiley, New York, 1980).Google Scholar
4. Chengalva, M.K., Ph.D. dissertation, The Ohio State University, 1994.Google Scholar