Published online by Cambridge University Press: 21 February 2011
In this paper both the substrate doping concentration and single crystal silicon orientation are considered when dielectrics are grown on silicon in a nitrous oxide environment. Our initial preliminary findings show that for heavily doped subtrates thicker layers of dielectric result compared to their lower doped counterparts. Furthermore we find a crossover point of temperature for growth rate for <111> compared to <100>. We believe that the different growth rates are attributable to nitrogen build up at the dielectric interface.