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Stresses in Films Deposited by Planar Magnetron Sputtering on Glass Substrates of Different Thickness

Published online by Cambridge University Press:  22 February 2011

Zhi-Feng Zhou
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing, CHINA
Yu-Dian Fan
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing, CHINA
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Abstract

Stresses affect the structure and properties of the films significantly. In this paper, Co-Cr films were deposited by D.C. planar magnetron sputtering on rectangular glass plates of thickness varied from 0.18 to 2.00mam. The measurement of stress was performed by the bending plate technique with the detection of capacitance change. The temperature of the bending plate was measured by an Fe-Ni thin film thermocouple on the back side of the substrate. The experimental results showed that the stresses were all tensile, but in the films on the thicker substrates were smaller than that on the thinner ones. And apparently the temperature rise of the thicker substrates during deposition was lower than that of the thinner ones. The magnetic characteristics of the Co-Cr films related to the substrate thickness may be attributed to both stress and temperature difference in the films deposited on the substrates of different thickness.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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