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Polyimides and Copolyimides with Low Dielectric Constant, Low Moisture Absorption, and Low Coefficient of Thermal Expansion for use as Interlayer Dielectrics

Published online by Cambridge University Press:  25 February 2011

Brian C. Auman
Brian C. Auman*
Affiliation:
DuPont Company, Electronic Materials, Experimental Station, E336/205, Wilmington, DE 19880
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Abstract

The mechanical, thermal, electrical and moisture absorption properties of a series of fluorinated, highly rod-like polyimides and copolyimides are reported. Copolymerization with appropriate flexibilizing comonomers resulted in improved elongations versus those of the highly rod-like homopolymers while maintaining, to a large extent,the other desirable properties of the backbone. These materials are considered prime candidates for interlayer dielectric due to their excellent combination of properties.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 337: Symposium B – Advanced Metallization for Devices and Circuits—Science, Technology and Manufacturing III , 1994 , 705
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

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