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Particle Metrology in CMP Slurries - Potential and Limitations of Relevant Measuring Methods

Published online by Cambridge University Press:  01 February 2011

Michael Stintz ,
Herbert Barthel  and
Mansour Moinpour
Michael Stintz
Affiliation:
[email protected], TU Dresden, Inst. of Chemical Engineering, Helmholtzstr. 10, Dresden, 01062, Germany, 49 351 4633 5176, 49 351 4633 7058
Herbert Barthel
Affiliation:
[email protected], Wacker Chemie AG, München, 81737, Germany
Mansour Moinpour
Affiliation:
[email protected], Intel Corporation, Santa Clara, CA, 95052, United States
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Abstract

The design of nanostructured materials like CMP slurries on an industrial scale requires the control of disperse systems of nanoparticles as well as of single isolated "bad" particles . It is well known that slurry abnormalities resulting from large abrasive particles and abrasive particles agglomeration can cause defects on wafer surfaces during CMP.

Particle-particle interactions generate secondary nanometer structures, clusters or agglomerates, which can dominate the relevant properties of the bulk material. Size and structure of these particle agglomerates/structures are the result of a dynamic equilibrium between agglomeration and desagglomeration. There is still a lack of understanding of these secondary soft nano- up to micro- particles because no adequate characterization methods are established.

Dilution and other preparation treatment to enable analysis by laboratory methods like TEM or AFM will distort the interparticle forces and will generate artifacts. Hence characterization methods are under investigation which can tolerate a high number of particles in the sensing zone. These high concentration methods often deliver ambiguous results. Consequently different physical principles have to be combined to get unambiguous information on the disperse state.

Performance characteristics of ultrasonic spectroscopy, photon correlation spectroscopy, analytical photo-centrifugation method combined with the high spatial resolution as well as special single particle optical counters are discussed on examples.

Keywords

CMPparticulatemicroelectronics
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 991: Symposium C – Advances and Challenges in Chemical Mechanical Planarization , 2007 , 0991-C04-02
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1 Basim, G.B., Adler, J.J., Mahajan, U., Singh, R.K., Moudgil, B.M., J. Electrochem. Soc. 147, 9,pp.3523–3528 (2000).Google Scholar
2 Steigerwald, J. M., Murarka, S.P., Gutmann, R.J., Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, New York (1997).Google Scholar
3 Moinpour, M., Tregub, A., Oehler, A., Cadien, K., MRS Bulletin, 27, 10, pp.766–771 (2002).Google Scholar
4 Kuntzsch, T., Witnik, U., Hollatz, M., Stintz, M., Ripperger, S., Chem. Eng. Technol. 26,12, pp.1235–1239 (2003).Google Scholar
5 Kuntzsch, T., Stintz, M., Ripperger, S. und Witnik, U., ”The impact of agglomerates on the chemical mechanical polishing (CMP) of wafer surfaces with colloidal slurries”, Poster Nanofair Dresden, VDI-Berichte 1803, Düsseldorf ISBN 3-18-091803-9, pp.103–108 (2003).Google Scholar
6 Babick, F., Hinze, F., Stintz, M., Ripperger, S., Part. Part. Syst. Charact. 15, pp.230–236(1998).Google Scholar
7 Babick, F., Ripperger, S., Part. Part. Syst. Charact. 19, pp. 176–185 (2002).Google Scholar
8 Babick, F., Stintz, M., Richter, A., Ripperger, S., “The position of ultrasonic spectroscopy within submicron particle size analysis methods”, PARTEC, Proceedings 22.3, Nürnberg (2004).Google Scholar
9 Kützel, U., Stintz, M., Babick, F., Barthel, H., Gottschalk-Gaudig, T., ” The Granulometric Properties of Pyrogenic Silica Suspensions”,Orlando, 5th World Congress on Particle Technology, Proceedings (2006).Google Scholar
10 Witt, W., Geers, H., Aberle, L., ” Measurement of Particle Size and Stability of Nanoparticles in Opaque Suspensions and Emulsions with Photon Cross Correlation Spectroscopy (PCCS)”, PARTEC, Proceedings P107, Nürnberg (2004).Google Scholar
11 Finsy, R., Part. Part. Syst. Charact. 7, pp.74–79 (1990).Google Scholar
12 Remsen, E. E., Anjur, S., Boldridge, D., Kamiti, M., Li, S., Johns, T., Dowell, C., Kasthurirangan, J., Feeney, P., Journal of The Electrochemical Society, 153,5, pp. G453–G461 (2006).Google Scholar