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A Novel Implantation Free Raised Source/Drain Mosfet Process Using Selective Rapid Thermal Chemical Vapor Deposition Of In-Situ Boron Doped SixGe1-x

Published online by Cambridge University Press:  21 February 2011

Xiaowei Ren
Affiliation:
North Carolina State University, Department of Electrical and Computer Engineering Box 7911, Raleigh, NC 27695-7911
Mehmet C. Öztürk
Affiliation:
North Carolina State University, Department of Electrical and Computer Engineering Box 7911, Raleigh, NC 27695-7911
Douglas T. Grider
Affiliation:
North Carolina State University, Department of Electrical and Computer Engineering Box 7911, Raleigh, NC 27695-7911
Mahesh Sanganeria
Affiliation:
North Carolina State University, Department of Electrical and Computer Engineering Box 7911, Raleigh, NC 27695-7911
Stanton Ashburn
Affiliation:
North Carolina State University, Department of Electrical and Computer Engineering Box 7911, Raleigh, NC 27695-7911
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Abstract

In this paper, we report electrical characterization of raised source/drain MOS transistors fabricated using selectively deposited, in-situ boron doped SixGe1-x as a solid diffusion source to form the source/drain junctions. The alloy can be deposited with an enhanced selectivity at temperatures as low as 600°C resulting in an abrupt doping profile at the SixGe1-x/Si interface. After deposition, junctions are formed by diffusion of boron from the deposited layer into the silicon substrate. The selectively deposited alloy can serve as a sacrificial layer for self-aligned silicide formation elimintaing the problem of silicon consumption in the substrate. In this work, selective depositions were performed in a typical cold-walled, lamp heated rapid thermal chemical vapor deposition (RTCVD) system at ∼ 610 °C using SiH2C12, GeH4 and B2H6 as the reactive gases. Using this process, MOS transistors with effective channel lengths down to 0.45 gtm were successfully fabricated.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

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