Article contents
Mechanical Behaviour of Two Sorts of MCM Structures
Published online by Cambridge University Press: 21 February 2011
Abstract
We analysed the mechanical response of samples, representing Flip-Chip bonded type structures. Two sort of distributions of the PbSn solder bumps, interconecting a chip to a substrate were investigated. The mechanical response was established from macroscopic shear and tensile tests. The microstructural evolution to complete mechanical failure, was observed during similar tests, but performed in a Scanning Electron Microscope. These in-situ tests revealed a preferential crack nucleation site in the samples, specific to one of the interfaces. A complementary numerical analysis was developed, for trying to explain the preferential crack opening site.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 1995
References
REFERENCES
- 1
- Cited by