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Mechanical Behaviour of Two Sorts of MCM Structures

Published online by Cambridge University Press:  21 February 2011

G. Pozza
Affiliation:
Institut National Polytechnique de Grenoble, ENSEEG BP.75, Dom. Univ., 38402 Saint-Martin d'Hères, France.
G. Parat
Affiliation:
LETI, CEA, 17 Av. des Martyrs, 38054 Grenoble, France.
M. Ignat
Affiliation:
Institut National Polytechnique de Grenoble, ENSEEG BP.75, Dom. Univ., 38402 Saint-Martin d'Hères, France.
M. Dupeux
Affiliation:
Institut National Polytechnique de Grenoble, ENSEEG BP.75, Dom. Univ., 38402 Saint-Martin d'Hères, France.
J. M. Terriez
Affiliation:
Institut National Polytechnique de Grenoble, ENSEEG BP.75, Dom. Univ., 38402 Saint-Martin d'Hères, France.
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Abstract

We analysed the mechanical response of samples, representing Flip-Chip bonded type structures. Two sort of distributions of the PbSn solder bumps, interconecting a chip to a substrate were investigated. The mechanical response was established from macroscopic shear and tensile tests. The microstructural evolution to complete mechanical failure, was observed during similar tests, but performed in a Scanning Electron Microscope. These in-situ tests revealed a preferential crack nucleation site in the samples, specific to one of the interfaces. A complementary numerical analysis was developed, for trying to explain the preferential crack opening site.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

[1] Satoh, R., Arakaw, K., Harada, M., Matsui, K., IEEE Transactions, Vol.14, N°1, p.224232, (1991).Google Scholar
[2] Frear, D., Grivas, D., Morris, J.W., Journal of Electronic Materials, Vol.17, N°2, p. 171177, (1988).Google Scholar
[3] Goldmann, L.S., Herdzik, R.D., Koopman, N.G., Marcotte, V.C., IEEE Transactions, Vol. PHP–13, N°3, p.194201, (1977).Google Scholar
[4] Hall, P.M., Dixon, T., Argyle, J.F., IEEE Transactions, Vol. CHMT–6, N°4, p.544552, (1984).Google Scholar
[5] Hall, P.M., IEEE Transactions, VOl. CHMT–7, N°4, p. 314327, (1984).Google Scholar
[6] Pozza, G., Mémoire CNAM “Fiabilité Mdcanique de Structures MCM”, Grenoble, France, 1995.Google Scholar
[7] Lopin, G., Rigolot, A., Eur. J. Mech., A/solids, Vol.11, N°3, p. 305321 (1992).Google Scholar
[8] Chouaf, A., Lopin, G., Ignat, M., Terriez, J.M., Mat. Res. Soc. Symp. Proc., Vol.309, p.211216 (1993).Google Scholar
[9] Ashby, M.F., Jones, D.R.H. “Engineering Materials 1” Pergamon Press Oxford G.B. (1981).Google Scholar
[10] Frost, H.J., in “Solder Joint Reliability” Lau, J.H. editor VNB Van Nostrand New-York, pp.266278, (1991).Google Scholar
[11] Hansen, P.M., “Constitution of binary alloys” Ed. M.G. Hill, (1958).Google Scholar