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Measuring the Strength and Stiffness of Thin Film Materials by Mechanically Deflecting Cantilever Microbeams

Published online by Cambridge University Press:  22 February 2011

T. P. Weihs ,
S. Hong ,
J. C. Bravman  and
W. D. Nix
T. P. Weihs
Affiliation:
Department of Materials Science and Engineering Stanford University, Stanford, CA, 94305.
S. Hong
Affiliation:
Department of Materials Science and Engineering Stanford University, Stanford, CA, 94305.
J. C. Bravman
Affiliation:
Department of Materials Science and Engineering Stanford University, Stanford, CA, 94305.
W. D. Nix
Affiliation:
Department of Materials Science and Engineering Stanford University, Stanford, CA, 94305.
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Abstract

The present authors recently introduced the mechanical deflection of cantilever microbeams as an experimental technique for measuring the strength and stiffness of thin films.[1] The technique utilizes conventional integrated circuit (IC) fabrication to process the samples, a Nanoindenter to deflect the cantilever beams mechanically, and simple elastic beam theory to analyze the data. This paper will review the technique and describe some of its current applications.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 130: Symposium C – Thin Films: Stresses and Mechanical Properties I , 1988 , 87
Copyright
Copyright © Materials Research Society 1989

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References

1. Weihs, T.P., Hong, S., Bravman, J.C., and Nix, W.D., J. Mater. Res. 5, 931 (1988).Google Scholar
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4. Farthing, L.J., Weihs, T.P., Kisker, D.W., Krajewski, J.J., Tang, M.F., and Stevenson, D.A., presented at Fall MRS Meeting, Boston, MA, 1988 (to be published).Google Scholar
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