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In-Situ Tem Study of Copper-Tin Intermetallic Formation

Published online by Cambridge University Press:  15 February 2011

Yujing Wu ,
Elizabeth G. Jacobs ,
Cyrus Pouraghabagher  and
Russell F. Pinizzotto
Yujing Wu
Affiliation:
Center for Materials Characterization, University of North Texas, Denton, TX 76203-5308
Elizabeth G. Jacobs
Affiliation:
Center for Materials Characterization, University of North Texas, Denton, TX 76203-5308
Cyrus Pouraghabagher
Affiliation:
Center for Materials Characterization, University of North Texas, Denton, TX 76203-5308
Russell F. Pinizzotto
Affiliation:
Center for Materials Characterization, University of North Texas, Denton, TX 76203-5308
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Abstract

The formation and growth of Cu6Sn5 and Cu3Sn at the interface of Sn-Pb solder/copper substrate are factors which affect the solderability and reliability of electronic solder joints. The addition of particles such as Ni to eutectic Sn-Pb solder drastically affects the activation energies of formation for both intermetallics. This study was performed to understand the mechanisms of intermetallic formation and the effects of Ni on intermetallic growth. Cu/Sn and Cu/Sn/Ni thin films were deposited by evaporation and observed in the TEM in real time using a hot stage. The diffusion of Sn through Cu6Sn5 and Cu3Sn followed by reaction with Cu must occur for intermetallic formation and growth to take place. Ni is an effective diffusion barrier which prevents Sn from diffusing into Cu.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 165
Copyright
Copyright © Materials Research Society 1994

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