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High Resolution Transmission Electron Microscope Study of UHV Deposited Titanium Thin Films on (001), (III) and (011)Si

Published online by Cambridge University Press:  21 February 2011

M. H. Wang
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan, Republic of China
L. J. Chen
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan, Republic of China
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Abstract

High resolution transmission electron microscopy has been applied to study the formation of amorphous interlayers by solid-state diffusion in ultrahigh vacuum deposited Ti thin films on (001), (111) and (011)Si

The interface structures of as deposited and annealed samples were examined. The disordered regions at the a-interlayer/c-Si interfaces were found to be most and least extensive in (011) and (111) samples, respectively. Growth behaviors of a-interlayers are described. The amorphization appeared to be initiated at the grain boundaries of Ti thin films. Ti5 Si3 was identified to be the phase formed at the initial stage of the interfacial reactions by HREM in conjunction with the optical diffraction.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

1. Schwarz, R.B. and Johnson, W.L., Phys. Rev. Lett. 51, 415 (1983).Google Scholar
2. Johnson, W.L., Progr. Mat. Sci. 30, 81 (1988).Google Scholar
3. Tu, K.N. and Chou, T.C., Phys. Rev. Lett. 61, 1863 (1988).10.1103/PhysRevLett.61.1863Google Scholar
4. Abelson, J.R., Kim, K.B., Mercer, D.E., Helms, C.R., Sinclair, R., and Sigmon, T.W., J. Appl. Phys. 63, 689 (1988).Google Scholar
5. Chen, L.J., Wu, I.W., Chu, J.J., and Nieh, C.W., J. Appl. Phys. 63, 2778 (1988).Google Scholar
6. Morgan, A.E., Broadbent, E.K., Ritz, K.N., Sadana, D.K., and Burrow, B.J., J. Appl. Phys. 64, 344 (1988).Google Scholar
7. Lur, W. and Chen, L.J., Appl. Phys. Lett. 54, 1219 (1989).10.1063/1.100720Google Scholar
8. Cheng, J.Y. and Chen, L.J., Appl. Phys. Lett. 56, 457 (1990).Google Scholar
9. Waser, R.M. and Bene, R.W., Appl. Phys. Lett. 28, 624 (1976)Google Scholar
10. Tu, K.N. and Mayer, J.W., in Thin Films-Interdiffusion and Reactions, edited by Poate, J.M., Tu, K.N., and Mayer, J.W. (Wiley, New York, 1978) p. 359.Google Scholar
11. Nicolet, M.A. and Lau, S.S., in Materials and Process Characterization, edited by Einspruch, N.G. and Larrabee, G.R. (Academic, New York, 1983), p. 329.Google Scholar
12. Gosele, U. and Tu, K.N., J. Appl. Phys. 53, 3252 (1982).Google Scholar
13. d'Heurle, F.M., J. Mater. Res. 3, 167 (1988).Google Scholar
14. Sheng, T.T. and Chang, C.C., IEEE Trans. Electron. Devices ED–23, 531 (1976).10.1109/T-ED.1976.18447Google Scholar
15. Chen, L.J. and Wu, I.W., J. Appl. Phys. 52, 3310 (1981)Google Scholar
16. Meng, W.J., Nieh, C.W., and Johnson, W.L., Appl. Phys. Lett. 51, 1693 (1987).10.1063/1.98546Google Scholar
17. Bene, R.W., J. Appl. Phys. 61, 1826 (1987).Google Scholar
18. Raaijmakers, I.J.M.M., Reader, A.H., and Oosting, P.H., J. Appl. Phys. 62, 2790 (1988).Google Scholar