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High Resolution Electron Microscopy of Defects in High-Dose Oxygen Implanted Silicon-On-Insulator Material

Published online by Cambridge University Press:  21 February 2011

S. Visitserngtrakul
Affiliation:
Dept. Chemical, Bio & Materials Engineering, Arizona State University, Tempe, AZ 85287
C. O. Jung
Affiliation:
Dept. Chemical, Bio & Materials Engineering, Arizona State University, Tempe, AZ 85287
B. F. Cordts
Affiliation:
Ibis Technology Corporation, Danvers, MA 01923
P. Roitman
Affiliation:
National Institute of Standard and Technology, Caithersburg, MD 20899
S. J. Krause
Affiliation:
Dept. Chemical, Bio & Materials Engineering, Arizona State University, Tempe, AZ 85287
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Abstract

High resolution electron microscopy (HREM) has been used to study the atomic arrangement of defects formed during high-dose oxygen implantation of silicon-on-insulator material. The effect of implantation parameters of wafer temperature, dose, and current density were investigated. Wafer temperature had the largest effect on the type and character of the defects. Above the buried oxide layer in the top silicon layer, HREM revealed that microtwins and stacking faults were created during implantation from 350–450°C. From 450–550°C, stacking faults were longer and microtwinning was reduced. From 550–700°C, a new type of defect was observed which had lengths of 40 to 140 nm and consisted of several discontinuous stacking faults which were randomly spaced and separated by two to eight atomic layers. We have referred to them as “multiply faulted defects” (MFDs). Beneath the buried oxide layer in the substrate region, the defects observed included stacking faults and ( 113 ) defects. The results indicated that some parts of the ( 1131 defects can assume a cubic diamond structure created through a twin operation across (115) planes. Details of the structure and formation mechanisms of MFDs and other defects will be discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

1. Izumi, K., Doken, M., and Ariyoshi, H., Electron. Lett., 14, 593 (1978).Google Scholar
2. Colinge, J.P., IEEE Electron Dev. Lett., EDL-7, 279 (1986).Google Scholar
3. Hemment, P. L. F., Maydell-Ondrusz, E., Stephens, K. G., Butcher, J. B., Ioannov, D., and Alderman, J., Nucl. Instr. and Meth. 209/210, 157 (1983).Google Scholar
4. Wittkower, A. and Guerra, M., Nucl. Instr. and Meth. B37/38, 512517 (1989).Google Scholar
5. White, A.E., Short, K.T., Dynes, R.C., Gibson, J.M., and Hull, R., Mat. Res. Soc. Proc., 107, 3 (1988).Google Scholar
6. Bourret, A., Inst. Phys. Conf. Ser. 87, 39 (1987).Google Scholar
7. Van Ommen, A.H., Koek, B.H., and Viegers, M.P.A., Appl. Phys. Lett. 49,628 (1986).Google Scholar
8. Reiche, M. and Breitenstein, O., Phys. Stat. Sol. (a) 101, K97 (1987).Google Scholar
9. Bender, H. and Vanhellemont, J., Phys. stat. Sol. (a) 107, 455 (1988).Google Scholar
10. EI-Ghor, M.K., Pennycook, S.J., Sorjeen, T.P., White, C.W., Biuono, N., and Narayan, J., Mat. Res. Soc. Proc. 107, 79.(1988)Google Scholar
11. Maszara, W.P., J. Appl. Phys. 64, 123 (1988).Google Scholar
12. Visitserngtrakul, S., Proc. Elec. Micr. Soc. Amer. 47, 606 (1989).Google Scholar
13. Visitserngtrakul, S., Krause, S.J., and Cordts, B.F., Submitted to Appl. Phys. Lett. (1989).Google Scholar
14. Tan, T. Y. and Tice, W. K., Phil. Mag. 30, 615 (1976).Google Scholar
15. Pirouz, P., Scripta Met. 21, 1463 (1987).Google Scholar
16. Hetherington, C.J.D., Dahmen, U., Pirouz, P., and Westmacott, K.H. in Proc. 47th Elect. Mic. Soc. Amer., edited Bailey, G.W., San Francisco Press, Inc., (1989) pp 132133.Google Scholar
17. Tan, T.Y., Foil, H., and Hu, S.M., Phil. Mag. A 44, 127 (1981).10.1080/01418618108244498Google Scholar
18. Pirouz, P., Chaim, R., and Dahmen, U., Mat. Res. Soc. Proc. 104, 133.(1988).10.1557/PROC-104-133Google Scholar