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Heteroepitaxy on (001) Silicon: Growth Mechanisms and Defect Formation.

Published online by Cambridge University Press:  28 February 2011

P. Pirouz
Affiliation:
Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, OHIO 44106
F. Ernst
Affiliation:
Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, OHIO 44106
T. T. Cheng
Affiliation:
Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, OHIO 44106
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Abstract

In the growth of thin films of compound semiconductors on (001) silicon substrates by vapor deposition techniques, it is usual to employ a two-step process. In this method, an initial (buffer) layer is first grown at a relatively low temperature; once a continuous film has formed on the substrate, its temperature is raised for the subsequent bulk growth. Carrying out the growth in a one-step process by heating the substrate to the final temperature before allowing the gases into the CVD reactor usually results in a polycrystalline aggregate. In this paper, classical nucleation and growth mechanisms are used to explain-the reasons for the different morphology of the one-step and two-step growth films.

The heteroepitaxial films on (001) silicon often contain a high density of stacking faults and twins. The occurrence of these planar defects is usually attributed to stresses that arise from lattice mismatch and/or thermal mismatch (differences in coefficients of thermal expansion) between the substrate and the epilayer. It is argued that, in fact, mismatch stresses play a minor role in the generation of planar defects. Instead, an alternative mechanism for their formation is proposed which is based on the facetted shape of nuclei and errors in stacking of {111} planes which occur during deposition on the facets.

Conventional and high resolution transmission electron microscopy have been used to investigate three systems grown by CVD or MOCVD: SiC/Si, GaAs/Si and GaP/Si. These systems have different lattice and thermal mismatches, and the results support the proposed model for the formation of defects.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

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References

[1] Olson, J. M., Al-Jassim, M. M., Kibbler, A., and Jones, K. M., J. Crystal Growth, 77, 515 (1986).Google Scholar
[2] Akiyama, M., Kawarada, Y., and Kaminishi, K., J. Crystal Growth 68, 21 (1984).Google Scholar
[3] Nishino, S., Powell, J. A., and Will, H. A., Appl. Phys. Lett. 42, 460 (1983).CrossRefGoogle Scholar
[4] Christian, J. W., “The Theory of Transformations in Metals and Alloys”, 2nd. Edition, Pergamon Press, pp. 418475, (1981).Google Scholar
[5] Powell, J. A., Matus, L. G., and Kuczmarski, M. A., J. Electrochem. Soc. 134, 1558 (1987).Google Scholar
[6] Chorey, C. M., Pirouz, P., Powell, J. A., and Mitchell, T. E., in ‘Semiconductor-Based Heterostructures: Interfacial Structure and Stability’, Ed. Green, M. L. et al., TMS Publications (1987), p. 115.Google Scholar
[7] Chorey, C. M., M.Sc. Thesis, Case Western Reserve University, 1987.Google Scholar
[8] Maeda, K., Suzuki, K., Fujita, S., Ichihara, M., and Hyodo, S., Submitted to Phil. Mag.Google Scholar
[9] Gottschalk, H., Patzer, G., and Alexander, H., Phys. Stat. Sol. (a) 45, 207 (1978).Google Scholar
[10] , Ernst and , Pirouz, unpublished.Google Scholar
[11] Al-Jassim, M. M., Olson, J. M., and Jones, K. M., Mat. Res. Soc. Symp. Proc. 62, 49 (1986).CrossRefGoogle Scholar
[12] fegelsen, D. K., Ponce, F. A., Smith, A. J., and Tramontana, J. C., J. Appl. Phys. 61, 1856 (1987).CrossRefGoogle Scholar
[13] Hull, R. and Fischer-Colbie, K., Appl. Phys. Lett. 50, 851 (1987).CrossRefGoogle Scholar
[141 Bauer, E., Z. Kristallogr. 110, 372 (1958).CrossRefGoogle Scholar
[15] Burton, W. K., Cabrera, N., ana Frank, F. C. Phil. Trans. R. Soc. Lond. A243, 299 (1951).Google Scholar
[16] Markov, I. and Stoyanov, S., Contemp. Phys. 28, 267 (1987).CrossRefGoogle Scholar
[17] Cheng, T. T., Pirouz, P., and Powell, J. A., iipublished.Google Scholar
[18] Ernst, F. and Pirouz, P., Submitted to J. Appl. Phys. (1988).Google Scholar
[19] Müller, H. J., J. Physique 43, CI133 (1982).Google Scholar
[20] Pirouz, P., Chorey, C. M., Cheng, T. T., and Powell, J. A., Mat. Res. Soc. Symp. Proc. 91, 399 (1987).CrossRefGoogle Scholar
[21] Pirouz, P., Chorey, C. M., Cheng, T. T., and Powell, J. A., Inst. Phys. Conf. Ser. No. 87, 175 (1987).Google Scholar
[22] Bootsma, G. A., Knippenberg, W.-F., and Verspui, G., J. Crystal Growth 11, 297 (1971).CrossRefGoogle Scholar
[23] Neave, J. H., Larsen, P. K., Joyce, B. A., Gowers, J. P., and Veen, J. F. van der, J. Vac. Sci. Technol. B 1, 668 (1983).Google Scholar
[24] Pirouz, P., Chorey, C. M., and Powell, J. A., Appl. Phys. Lett. 50, 221 (1987).Google Scholar
[25] Booker, G. R. and Stickler, R., J. Appl. Phys. 33, 3281 (1962).Google Scholar
[26] Booker, G. R. and Stickler, R., Appl. Phys. Lett. 3, 158 (1963).CrossRefGoogle Scholar
[27] Cullis, A. G. and Booker, G. R., J. Crystal Growth 9, 132 (1971).Google Scholar
[28] Joyce, B. A., Neave, J. H., and Watts, B. E., Surface Sci. 15, 1, (1969).Google Scholar
[29] Abbink, H. C., Broudy, R. M., and McCarthy, G. P., J. Appl. Phys. 39, 4673 (1968).Google Scholar
[30] Jona, F., Appl. Phys. Lett. 9, 235 (1966).CrossRefGoogle Scholar
[31] Kasper, E., Herzog, H. J., and Kibbel, H., Appl. Phys. 8, 199 (1975).Google Scholar
[32] Akiyama, M., Kawarada, Y., Ueda, T., Nishi, S., and Kaminishi, K., J. Crystal Growth 77, 490 (1986).CrossRefGoogle Scholar