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Electronics Packaging Materials Research at NIST

Published online by Cambridge University Press:  21 February 2011

Michael A. Schen ,
G. T. Davis ,
F. I. Mopsik ,
W. L. Wu ,
W. E. Wallace ,
Jr. Manning ,
C. A. Handwerker  and
D. T. Read
Michael A. Schen
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA
G. T. Davis
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA
F. I. Mopsik
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA
W. L. Wu
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA
W. E. Wallace
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA
Jr. Manning
Affiliation:
Metallurgy Division, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA
C. A. Handwerker
Affiliation:
Metallurgy Division, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA
D. T. Read
Affiliation:
Materials Reliability Division Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA
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Abstract

The Materials Science and Engineering Laboratory at NIST has augmented its laboratory-based research in support of the U.S. commercial microelectronics industry by expanding its efforts in electronics packaging, interconnection and assembly (P/I/A) materials technologies. In conjunction with industry, university and other government agency partners, these new NIST efforts target materials technology issues that underlie the priorities contained within the various electronics industry technology roadmaps. A dominant aspect of the laboratory P/I/A program focuses on the in-situ metrology and data needs associated with the materials and complex material assemblies which comprise today's microelectronic components and circuits.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 19
Copyright
Copyright © Materials Research Society 1995

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References

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