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Electromigration-Induced Stress Interaction between Via and Polygranular Cluster

Published online by Cambridge University Press:  17 March 2011

Young-Joon Park ,
In-Suk Choi  and
Young-Chang Joo
Young-Joon Park
Affiliation:
Thin Film Technology Research Center, Korea Institute of Science and Technology, Seoul 130-650, Korea
In-Suk Choi
Affiliation:
Seoul National University, School of Materials Science and Engineering, Seoul 151-742, Korea
Young-Chang Joo
Affiliation:
Seoul National University, School of Materials Science and Engineering, Seoul 151-742, Korea
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Abstract

We have investigated the stress interaction between via and polygranular cluster in the pure Al line using 1-dimensional computer simulation. The conventional belief was that the fastest stress evolution at the via occurs when the polygranular cluster is just below (or above) the via. However, the electromigration induced stress at the via would be faster when a cluster is apartfrom via because the stress interaction between via and clusters may assist electromigration. We simulated the time that the via reaches a certain stress value as a function of the distance of the cluster. It gives a specific distance where the time was minimum (i.e the fastest stress evolution). We named the position as the Fastest Stress Enhancing Polygranular cluster Position (FaSEPP). As a function of the current density, the FaSEPP decreases.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 612: Symposium D – Materials, Technology & Reliability for Advanced Interconnects.. , 2000 , D8.11.1
Copyright
Copyright © Materials Research Society 2000

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