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Effects of Curing Temperature on the Mechanical Reliability of Low Dielectric-Constant Spin-on-Glasses

Published online by Cambridge University Press:  17 March 2011

Yvete Toivola ,
Robert F. Cook  and
Chandan Saha
Yvete Toivola
Affiliation:
Department of Chemical Engineering and Materials ScienceUniversity of Minnesota421 Washington Avenue SE, Minneapolis, MN 55455
Robert F. Cook
Affiliation:
Department of Chemical Engineering and Materials ScienceUniversity of Minnesota421 Washington Avenue SE, Minneapolis, MN 55455
Chandan Saha
Affiliation:
Dow Corning Corporation 2200 W. Salzburg Road, Midland, MI 48686
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Abstract

The variations in the mechanical properties of a commercial low-k silsesquioxane material with curing temperature are examined, focusing on the transition from the low modulus, high stress, under-cured state to the high modulus, low stress, over-cured state. Film modulus and hardness are determined by instrumented nanoindentation and film dielectric constant is determined by ac capacitance measurements of metal dot structures. The mechanical behavior is correlated with changes in molecular structure via infrared spectroscopy. An implication of the results is that there is an intermediate curing temperature for optimum silsesquioxane interconnection performance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 612: Symposium D – Materials, Technology & Reliability for Advanced Interconnects.. , 2000 , D5.4.1
Copyright
Copyright © Materials Research Society 2000

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