Titanium silicide (TiSix), used as polycide gate consists of TiSi1.1 and amorphous silicon (a—Si), was deposited by Plasma Enhanced Chemical Vapor Deposition method (PE—CVD). The effect of a—Si layer in PE—CVD Ti polycide gate dielectrics has been studied. In order to evaluate the a—Si layer effect, three types of samples were prepared on gate SiO2 film with following structures: a) a—Si / TiSil.1 / a—Si / phosphorus (P) doped poly—Si, b) a—Si / TiSi1.1 / non—doped poly—Si / P doped poly—Si and c) a—Si / TiSi1.1 / P doped poly—Si, respectively. Furthermore, in order to avoid the influence of native oxide existence at the interface, the pre—cleaning treatment was performed in—situ on the poly—Si film surface before TiSi1.1 film deposition. The gate dielectric strengths of these samples indicate that the gate dielectric degradation in PE—CVD Ti polycide gate is greatly dependent on Si under layer crystallization. It is effective using a—Si film as the under layer in decreasing the gate dielectric degradation. This is due to the Ti oxide interlayer, formed at the interface of TiSi2.0 and poly—Si films, whichrestrains the TiSix local penetration.