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Deposition of Oxide Based Advanced Electronic and Optical Materials by Rapid Isothermal Processing (RIP) Assisted Metalorganic Chemical Vapor Deposition (MOCVD)

Published online by Cambridge University Press:  22 February 2011

J. Mavoori
Affiliation:
Dept. of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634
R. Singh
Affiliation:
Dept. of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634
R. Sharangpani
Affiliation:
Dept. of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634
C. Gong
Affiliation:
Dept. of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634
K. F. Poole
Affiliation:
Dept. of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634
R. K. Singh
Affiliation:
Dept. of Material Science & Engineering, University of Florida, Gainsville, FL
R. Natarajan
Affiliation:
Dept. of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634
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Abstract

Metalorganic chemical vapor deposition (MOCVD) is an ideal technique for the deposition of conducting and non-conducting oxide based thin film materials. In this paper we present our study of RIP assisted MOCVD for the low temperature deposition of a number of oxide based advanced materials which are useful for the development of the next generation of microelectronic and optoelectronic devices. We have designed several experiments to understand the role of photoeffects in RIP assisted MOCVD. The vacuum ultraviolet, ultraviolet and visible (λ ≤ 0.7–0.8μm) photons can have several beneficial effects including the enhancement of the surface reactions of the absorbed molecules through the perturbation of the electronic state of binding between the absorbed molecules and the solid surface. We have shown a direct relationship between the structural and electrical characteristics of the deposited oxide and the spectral contents of the energy source.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

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