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µc-Si:H Thin-Film Devices for Optical Image Recognition

Published online by Cambridge University Press:  10 February 2011

A. Maçarico ,
M. Fernandes ,
J. Martins  and
M. Vieira
A. Maçarico
Affiliation:
Electronics and Communications Department, ISEL, R. Conselheiro Emidio Navaro, 1900 Lisboa, Portugal
M. Fernandes
Affiliation:
Electronics and Communications Department, ISEL, R. Conselheiro Emidio Navaro, 1900 Lisboa, Portugal
J. Martins
Affiliation:
Electronics and Communications Department, ISEL, R. Conselheiro Emidio Navaro, 1900 Lisboa, Portugal
M. Vieira
Affiliation:
Electronics and Communications Department, ISEL, R. Conselheiro Emidio Navaro, 1900 Lisboa, Portugal
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Abstract

A study of an image detector based on µc-Si:H p-i-n structures is presented. The photodetector has a TCO/µc-p-i-n Si:H configuration with two coplanar metallic contacts and a transverse one.

We used a strong spatially fixed light pattern with different intensities to simulate the images and a weak moving light beam to sweep the device in the lateral direction, for its recognition. The sensor surface was scanned row by row and a signal processing procedure was applied to the data after each sweep. It was found that the induced transverse and lateral photovoltages are sensitive to the position and intensity of the image. Through a readout analysis it was possible to recognise, in a continuous way, the image position and relative intensity. The image resolution as a function of the pattern width and intensity is also analysed

A small signal circuit modelling and a simulation consistent with the experimental data are presented and explained. Preliminary tests show that the detector can be used as a two-dimensional image sensor.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 508: Symposium B – Flat Panel Display Materials - 1998 , January 1998 , 145
Copyright
Copyright © Materials Research Society 1998

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References

1. Torkel, J., Wallmark, Proc. IRE 43 (1956) 474.Google Scholar
2. Fortunato, E., Vieira, M., Ferreira, L., Carvalho, C. N., Lavareda, G., and Martins, R., Mat. Res. Soc. Symp. Proc. 297 (1993) 981.Google Scholar
3. Vieira, M., Appl. Phys. Lett. 70 (1997) 220.Google Scholar
4. Vieira, M., Magarico, A., Morgado, E., Koynov, S., and Schwarz, R., to be published in J. of Non-Cryst. Solids (1997).Google Scholar
5. Koynov, S., Schwarz, R., Fischer, T., Grebner, S., and Munder, H., Jpn. J. Appl. Phys. 33 (1994) 4534.Google Scholar
6. Krankenhagen, R., Schmidt, M., Henrion, W., Sieber, I., Koynov, S., Grebner, S., and Schwarz, R., Solid State Phenomena 47 (1995) 607.Google Scholar
7. Koynov, S., Grebner, S., Radojkovic, P., Hartmann, E., Schwarz, R, Vassilev, L., Krankenhagen, R., Sieber, I., Henrion, W., and Schmidt, M., J. of Non-Cryst. Solids 198–200 (1996) 1012.Google Scholar
8. Vieira, M., Koynov, S., Fantoni, A., and Schwarz, R., Thin Solid Films 296 (1997) 164.Google Scholar
9. Chen, I., J. Appl. Phys. 64 (1988) 2224.Google Scholar
10. Semiconductor Device Modeling with SPICE, edited by Antognetti, Paolo and Massobrio, Giuseppe, McGraw-Hill, 1994.Google Scholar
11. Lucovsky, G., J. of Appl. Phys. 41 (1960) 1088.Google Scholar