Hostname: page-component-78c5997874-m6dg7 Total loading time: 0 Render date: 2024-11-20T03:22:05.318Z Has data issue: false hasContentIssue false

Crystallization of Silicon Ion Implanted LPCVD Amorphous Silicon Films for High Performance Poly-TFT

Published online by Cambridge University Press:  21 February 2011

I-W. Wu
Affiliation:
Electronics and Imaging Lab., Xerox Palo Alto Research Center, Palo Alto, CA.
A. Chiang
Affiliation:
Electronics and Imaging Lab., Xerox Palo Alto Research Center, Palo Alto, CA.
M. Fuse
Affiliation:
EIDRL, Fuji Xerox Co., 2247 Hongo Ebina-Shi Kanagawa-Ken 243-04, Japan
L. Öveqoglut
Affiliation:
Devtech Int'l B.V., SW 9, 6422 PC Heerlen, The, Netherlands
T. Y. Huang
Affiliation:
Electronics and Imaging Lab., Xerox Palo Alto Research Center, Palo Alto, CA.
Get access

Abstract

The mechanism of silicon ion implantation on the crystallization kinetics and the resulting grain sizes of LPCVD α-Si films have been studied by x-ray diffraction and transmission electron microscopy. The solid-phase crystallization was proceeded by random nucleation and growth from the Si/SiO2 interface. The most effective grain size enhancement was found by targeting the peak concentration of implanted siliconbeyond the Si/SiO2 interface, such that the maximum kinetic energy transfer occurred at that interface. The average grain size increases from ∼0.16 μm to ∼2.0 μm by a Si + implantation at 92KeV and a dose of 2X1015 cm-2 for 0.1 μm silicon film. X-ray diffraction intensities were analyzed to optimize implanting dose, beam current and energy for different film thickness. Grain size enhancement was achieved by retarding the random nucleation and increasing the nucleation activation barrier from ∼3.9eV to ∼4.9 eV for the implanted sample. The amorphous to crystalline growth activation barrier of ∼3.2 eV was not altered by Si+ implantation. The observed nucleation and growth kinetics change may be due to the chemical effect of the recoiled oxygen atoms from the substrate. The field-effect mobilities for both n- and p-channel TFTs increase by a factor of two with deep silicon implant.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Chiang, A. et al. ; in Materials Res. Soc. Sympo. Proceed., edited by Wang, C. Y., Thompson, C. V., and Tu, K. N., 106, 305 (1987).Google Scholar
2. Malhi, S. D. S. et al. , IEEE Trans. Electron Devices, ED-32, 258 (1985).Google Scholar
3. Wu, I-W., Lewis, A. G., Huang, T. Y., and Chiang, A., IEEE. Elect. Dev. Lett., EDL-10, 123 (1989).Google Scholar
4. Wu, I-W. et al. ; IEEE. Elect. Dev. Lett., EDL-11, 167 (1990).Google Scholar
5. Hack, M. et al. , IEDM Tech. Digest., 252 (1988).Google Scholar
6. Chuang, T-C., Wu, I-W., huang, T. Y., and Chiang, A.; to be published in Soc. Inform. Display Int'n Sympo. (Las Vegas, May 1990).Google Scholar
7. Lewis, A. G., Huang, T. Y., Bruce, R. H., Koyanagi, M., Chiang, A., and Wu, I-W., IEDM Tech. Digest., 260 (1988).Google Scholar
8. Lewis, A. G., Bruce, R. H.; 1990 ISSCC Tech. Digest, 33, 222 (1990).Google Scholar
9. Lewis, A. G., Wu, I-W., Huang, T. Y., Koyanagi, M., Chiang, A., and Bruce, R. H., IEDM Tech. Digest., 264 (1988).Google Scholar
10. Wu, I-W., Lewis, A. G., Huang, T. Y., and Chiang, A.; to be published in Soc. Inform. Display Int'n Sympo. (Las Vegas, May 1990).Google Scholar
11. Kamins, T. I. and Marcoux, P. J., IEEE Electron Device Lett., EDL-1, 159, 1980.Google Scholar
12. Kung, K. T-Y., Iverson, R. B., and Reif, R., Appl. Phys. Lett., 46, 683 (1985).10.1063/1.95529Google Scholar
13. Egami, K., Ogura, A., and Kimura, M., J. Appl. Phys., 59, 289 (1986).10.1063/1.336831Google Scholar
14. Noguchi, T., Hayashi, H., and Ohshima, T., J. Electrochem. Soc., 134, 1771 (1987).Google Scholar
15. Wu, I-W., Chiang, A., Fuse, M., Ovèoglu, L., and Huang, T. Y.; J. Appl. Phys., 65, 4036 (1989).Google Scholar
16. Aoyama, T., Konishi, N., Suzuki, T., and Miyata, K., in Materials Res. Soc. Sympo. Proceed., edited by Wang, C. Y., Thompson, C. V., and Tu, K. N., 106, 347 (1987).Google Scholar
17. Morgiel, J., Wu, I-W., Chiang, A., and Sinclair, R.; this conference proceeding.Google Scholar
18. Brice, D. K., J. Appl. Phys., 46, 3385 (1975).Google Scholar
19. Kennedy, E. F., Csepregi, L., Mayer, J. W., and Sigmon, T. W., J. Appl. Phys., 48, 4241, (1977).Google Scholar