Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-29T07:46:10.002Z Has data issue: false hasContentIssue false

Characterization of Conductive Anodic Filament (Caf) by X-Ray Microtomography and by Serial Sectioning

Published online by Cambridge University Press:  15 February 2011

S. R. Stock
Affiliation:
School of Materials Sci. and Eng., Georgia Inst. of Technology, Atlanta, GA
L. L. Dollar
Affiliation:
presently with Lockheed Aeronautical Systems, Marietta, GA
G. B. Freeman
Affiliation:
Electrical, Optical and Materials Lab., Georgia Inst. of Technology, Atlanta, GA
W. J. Ready
Affiliation:
School of Materials Sci. and Eng., Georgia Inst. of Technology, Atlanta, GA
L. J. Turbini
Affiliation:
School of Materials Sci. and Eng., Georgia Inst. of Technology, Atlanta, GA
J. C. Elliott
Affiliation:
School of Materials Sci. and Eng., Georgia Inst. of Technology, Atlanta, GA
P. Anderson
Affiliation:
Dept. of Child Dental Health, London Hospital Medical College, London, UK
G. R. Davis
Affiliation:
School of Materials Sci. and Eng., Georgia Inst. of Technology, Atlanta, GA
Get access

Abstract

X-ray microtomography is used to nondestructively section printed wiring boards in which conductive anodic filaments (CAFs) had grown, Quantification of the spatial distribution of copper is compared for microtomography and for serial sections obtained in SEM with backscattered electrons. The agreement between the techniques is excellent and indicates that microtomography may be used confidently to follow the subsurface growth of CAFs.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Mitchell, J.P. and Welsher, T.L., Proceeding of Printed Circuit World, Convention II, June (1981).Google Scholar
2. Lahti, J.N., Delaney, R.H., and Hines, J.N., 17th Annual Proceedings Reliability Physics, 39 (1979).Google Scholar
3. Turbini, L.J., Freeman, G.B., Smith, M.H., Finney, J.D., Boswell, R.D., and Lane, J.F., Soldering & Surface Mount Technology, No. 8, June 1991, pp. 2631.Google Scholar
4. Turbini, L.J., Freeman, G.B. and Cauffiel, D., this volume.Google Scholar
5. Elliott, J.C., Bowen, D.K., Dover, S.D. and Davies, S.T., Biological Trace Element Res., 13, 219 (1987).CrossRefGoogle Scholar
6. Elliott, J.C., Anderson, P., Davis, G.R., Wong, F.S.L. and Dover, S.D., in press Journal of Metals (1994).Google Scholar
7. Kinney, J.H., Breunig, T.M., Starr, T.L., Haupt, D., Nichols, M.C., Stock, S.R., Butts, M.D. and Saroyan, R.A., Science, 260, 789 (1993).CrossRefGoogle Scholar