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Atomic Layer Deposition of Silica and Group IV Metal Oxides Nanolaminates

Published online by Cambridge University Press:  01 February 2011

Lijuan Zhong
Affiliation:
Department of Chemistry, University of Minnesota, Minneapolis, MN 55455, U.S.A.
Fang Chen
Affiliation:
Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN 55455, U.S.A.
Stephen A. Campbell
Affiliation:
Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN 55455, U.S.A.
Wayne L. Gladfelter
Affiliation:
Department of Chemistry, University of Minnesota, Minneapolis, MN 55455, U.S.A.
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Abstract

With alternating exposure of Si (100) substrates to tri (t -butoxy) silanol and anhydrous zirconium nitrate, mixed films of zirconia and silica were deposited at 162°C. The films were atomically smooth and their thickness was uniform across the entire substrate. The maximum growth rate of 12 Å/cycle implies deposition of more than one monolayer per cycle. A singular reflection in the low angle X-ray scattering pattern indicates an ordered bi-layer structure. Similar nanolaminate structures were also formed using anhydrous nitrates of hafnium and tin.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

(1) Qi, W. J.; Nieh, R.; Dharmarajan, E.; Lee, B. H.; Jeon, Y.; Kang, L. G.; Onishi, K.; Lee, J. C. Appl. Phys. Lett. 2000, 77, 1704.Google Scholar
(2) Wilk, G. D.; Wallace, R. M.; Anthony, J. M. J. Appl. Phys. 2000, 87, 484.Google Scholar
(3) Wilk, G. D.; Wallace, R. M. Appl. Phys. Lett. 2000, 76, 112.Google Scholar
(4) Lucovsky, G.; Rayner, G. B. Appl. Phys. Lett. 2000, 77, 2912.Google Scholar
(5) Gordon, R. G.; Becker, J.; Hausmann, D.; Suh, S. Chem. Mater. 2001, 13, 2463.Google Scholar
(6) Ritala, M.; Kukli, K.; Rahtu, A.; Raisanen, P. I.; Leskela, M.; Sajavaara, T.; Keinonen, J. Science 2000, 288, 319.Google Scholar
(7) Kim, W. K.; Kang, S. W.; Rhee, S. W.; Lee, N. I.; Lee, J. H.; Kang, H. K. J. Vac. Sci. Technol. A-Vac. Surf. Films 2002, 20, 2096.Google Scholar
(8) Vainonen-Ahlgren, E.; Tois, E.; Ahlgren, T.; Khriachtchev, L.; Marles, J.; Haukka, S.; Tuominen, M. Comput. Mater. Sci. 2003, 27, 65.Google Scholar
(9) He, W.; Solanki, R.; Conley, J. F.; Ono, Y. J. Appl. Phys. 2003, 94, 3657 Google Scholar
(10) Smith, R. C.; Hoilien, N.; Taylor, C. J.; Ma, T. Z.; Campbell, S. A.; Roberts, J. T.; Copel, M.; Buchanan, D. A.; Gribelyuk, M.; Gladfelter, W. L. J. Electrochem. Soc. 2000, 147, 3472.Google Scholar
(11) Colombo, D. G.; Gilmer, D. C.; Young, V. G. Jr; Campbell, S. A.; Gladfelter, W. L. Chem. Vap. Deposition 1998, 4, 220.Google Scholar
(12) Conley, J. F.; Ono, Y.; Tweet, D. J.; Zhuang, W.; Solanki, R. J. Appl. Phys. 2003, 93, 712.Google Scholar
(13) Hausmann, D.; Becker, J.; Wang, S. L.; Gordon, R. G. Science 2002, 298, 402.Google Scholar
(14) Schmeisser, M. Angew. Chem. 1955, 67, 493.Google Scholar
(15) Field, B. O. H., , C. J. Proc. Chem. Soc. 1962, 76.Google Scholar