Hostname: page-component-78c5997874-dh8gc Total loading time: 0 Render date: 2024-11-06T13:21:01.341Z Has data issue: false hasContentIssue false
  • English
  • Français

Advances in the Characterization of Particle Size Distributions of Abrasive Particles used in CMP

Published online by Cambridge University Press:  01 February 2011

Mungai Kamiti ,
Stacey Popadowski  and
Edward E. Remsen
Mungai Kamiti
Affiliation:
[email protected], Cabot Microelectronics Corp., R&D-Enabling, 870 N. Commons Drive, Aurora, IL, 60543, United States
Stacey Popadowski
Affiliation:
[email protected], Cabot Microelectronics Corp., R&D-Enabling, 870 N. Commons Drive, Aurora, IL, 60543, United States
Edward E. Remsen
Affiliation:
[email protected], Cabot Microelectronics Corp., R&D-Enabling, 870 N. Commons Drive, Aurora, IL, 60543, United States
Get access

Abstract

The use of density gradient stabilized centrifugal sedimentation (disc centrifugation) for the characterization of abrasive particles in CMP slurries is reported. For slurries prepared with ceria and colloidal silica abrasives, the technique is demonstrated as capable of providing highly repeatable analyses of the abrasive's apparent particle size distribution (PSD). The addition of water soluble organic additives to the slurries is shown to produce large shifts in the apparent PSD relative to the PSD of the pure abrasive particles. Particle-additive interactions driving the shift in apparent PSD could not be interpreted with confidence due to the lack of accurate densities for particle-abrasive complexes formed in the slurry. To address this problem, sucrose density gradients prepared using H2O and D2O were tested as spin fluids of different densities to analyze a colloidal silica standard with a narrow PSD. Preliminary results comparing experimental disc centrifuge data with theoretical simulations of the disc sedimentation pattern suggest that this technique can potentially characterize both the particle diameter and density of abrasive particles in a CMP slurry.

Keywords

slurryparticulateorganic
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 991: Symposium C – Advances and Challenges in Chemical Mechanical Planarization , 2007 , 0991-C04-03
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Steigerwald, J. M.; Muraka, S. P. and Gutmann, R. J. Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, New York, 1997.Google Scholar
2 Barth, H. G. and Sun, S. T. Anal. Chem. 1993, 65, 55R–66R.Google Scholar
3 Hoffman, R. L. J. Coll. Interface Sci. 1991, 143, 232–51.Google Scholar
4 Kamiti, M. “Particle Size Distribution Determination of CMP Abrasive Particles Using Density Gradient Stabilized Centrifugal Sedimentation”, Proc. 11 th Int. CMP for Multilevel ULSI Interconnection Conf. 2006, pp. 554–63.Google Scholar
5 Kim, H.; Deonier, R. C. and Williams, J. W. Chem. Rev. 1977, 77, 659–90.Google Scholar
6 Steinberg, I. Z. and Schachman, H. K. Biochemistry 1966, 5, 3728–47.Google Scholar
7 Springer, M. S. and Schachman, H. K. Biochemistry 1974, 13, 3726–33.Google Scholar
8 Edelstein, S. J. and Schachman, H. K. Methods Enzymol. 1973 27, 82–98.Google Scholar
9 Remsen, E. E.; Thurmond, K. B. and Wooley, K. L. Macromolecules 1999 32, 3685–9.Google Scholar
10 Giddings, J. C. and Ho, J. Langmuir 1995 11, 2399–2404.Google Scholar