Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-25T15:23:02.206Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesion Reliability of Cu-Cr Alloy Films to Polyimide

Published online by Cambridge University Press:  15 February 2011

E. C. Ahn ,
Jin Yu ,
T. C. Oh  and
I. S. Park
E. C. Ahn
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
Jin Yu
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
T. C. Oh
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
I. S. Park
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
Get access

Abstract

CuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide films were maintained under 350°C/N2 environment up to 10 hours for reliability measurements. Before exposure to 350°C, the peel strength increased proportionally with the Cr content in the alloy layer up to 17% and saturated. After exposure to 350°C, the peel strength dropped for all the specimens due to the formation of Cr2O3 at the metal/polyimide interface, and the effect was most drastic for the specimen with the lowest Cr content, which failed along the Cr-oxide/polyimide interface. Depletion of carbidic bonds at the metal/polyimide interface accompanied the oxide formation, and the result was quite devastating for the specimens with low Cr content in the alloy layer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 427: Symposium K – Advanced Metallization for Future ULSI , 1996 , 141
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Chung, T. G., Kim, Y. H. and Yu, Jin, J. Adhesion Sci. and Technol., 8 (1), 41–51 (1994)Google Scholar
2. Furman, B. K., Childs, K. D., Davis, R. and Purushothaman, S., J. Vac. Sci. and Technol., A10 (4), 2913–2920 (1992)Google Scholar
3. Oh, T. S., Kowalczyk, S. P., Hunt, D. J., and Kim, J., J. Adhesion Sci. and Technol., 4 (2), 119–129 (1990)Google Scholar
4. Ahn, E. C., Yu, Jin, and Park, I. S., Mater. Res. Soc. Sym. Proc., 390, 55–60 (1995)Google Scholar
5. Koopman, N. G., Reiley, T. C., Totta, P. A., Microelectronics Packaging Handbook, edited by Tummala, R. R. and Rymaszewski, E. J. Google Scholar
6. Anderson, G. P. and Devris, K. L., Treatise on Adhesion and Adhesives, vol.6, edited by Patirck, R. L., Marcel Dekker, Inc., 1989, p110.Google Scholar
7. Chan, C. J., Chang, C. A., Farrell, C. E., and Schourott, A. G., Appl. Phys. Lett., 62 (6), 654–656 (1993)Google Scholar
8. Furman, B., Purushothaman, S., Castellani, E. E., and Renick, S., Proc. of the Symp. On Multilevel Metallization, Interconnect, and Contact Techn., ECS, 142 (1986) (unpublished)Google Scholar
9. Callegari, A. C., Clearfield, H. M., Furman, B. K., Graham, T. G., Neugroschl, D., and Purushothaman, S., J. Vac. Sci. and Technol., A 12 (1), 185–191 (1994)Google Scholar
10. Jordan, J. L., Sanda, P. N., Morar, J. F., Kovac, C. A., Himpsel, F. J., and Pollak, R. A., J. Vac. Sci. and Technol., A4 (3), 1046–1048 (1986)Google Scholar
11. Burkstran, J. M., J. Appl. Phys., 52 (7), 4795–4800 (1981)Google Scholar
12. Ahn, E. C., Yu, Jin, and Park, I. S., to be publishedGoogle Scholar
13. Smith, M. A. and Levenson, L. L., Ph s. Rev. B, 16 (4), 1365–1369 (1977)Google Scholar
14. Ahn, E. C., Ph. D. Thesis, KAIST, Seoul, Korea.(1996)Google Scholar