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Highly spherical, mono-sized SnAgCu droplets by pulsated orifice ejection method

Published online by Cambridge University Press:  14 August 2017

Bingge Zhao
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Wei Dong*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, 2 Linggong Road, Dalian, Liaoning Province 116024, People's Republic of China
Huijun Ji
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Quanliang Zhang
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Ling Zhang
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Mannan Wu
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Qijie Zhai
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China
Yulai Gao*
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
*
Address all correspondence to Wei Dong, Yulai Gao at [email protected], [email protected]
Address all correspondence to Wei Dong, Yulai Gao at [email protected], [email protected]
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Abstract

Spherical Sn0.3Ag0.7Cu (wt.%) solder droplets with diameter ranging from 70.6 to 334.0 µm were prepared using pulsated orifice ejection method. Compared with conventional atomization, these droplets are almost completely spherical with a much narrower size distribution. The surface of these droplets is smooth without detectable satellite particles. Furthermore, both the composition and microstructure are homogenous throughout any single droplet regardless of their size. Detailed microstructural analysis shows that nano-sized Ag3Sn particles are distributed homogenously in the β-Sn matrix. The results suggest that the droplets have advantage as electronic packaging material and be a promising candidate material for three-dimensional printing.

Type
Research Letters
Copyright
Copyright © Materials Research Society 2017 

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