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Angled physical vapor deposition techniques for non-conformal thin films and three-dimensional structures

Published online by Cambridge University Press:  12 February 2016

Zhuoxian Wang
Affiliation:
School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47907, USA
Paul R. West
Affiliation:
School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47907, USA Intel Corporation, Hillsboro, OR 97124, USA
Xiangeng Meng
Affiliation:
School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47907, USA
Nathaniel Kinsey
Affiliation:
School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47907, USA
Vladimir M. Shalaev
Affiliation:
School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47907, USA
Alexandra Boltasseva*
Affiliation:
School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47907, USA
*
Address all correspondence to Alexandra Boltasseva at[email protected]
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Abstract

The field of nanophotonics has experienced a dramatic development in recent years, which requires ample candidate structures to achieve desirable functionalities. For many novel device designs in emerging field of transformation optics, optical metamaterials, and others, non-uniform and non-conformal thin films as well as three-dimensional (3D) structures are necessary to achieve advanced functionalities. Here, we report several techniques utilizing angled physical vapor deposition to obtain unique and complex 3D structures such as films with tapered thickness on planar substrates, tapered or uniform films on curved surfaces, and 3D nanorod arrays. These structures could enrich the existing practical design space for applications in nanophotonics and nanoelectronics.

Type
Plasmonics, Photonics, and Metamaterials Research Letters
Copyright
Copyright © Materials Research Society 2016 

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