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Reliability of inkjet printed silver nanoparticle interconnects on deformable substrates tested through an electromechanical in-situ technique

Published online by Cambridge University Press:  06 February 2019

Martina Aurora Costa Angeli ,
Tobias Cramer ,
Beatrice Fraboni ,
Luca Magagnin ,
Dario Gastaldi  and
Pasquale Vena
Martina Aurora Costa Angeli*
Affiliation:
Department of Chemistry, Materials and Chemical Engineering “Giulio Natta”, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy
Tobias Cramer
Affiliation:
Department of Physics and Astronomy, University of Bologna, Viale Berti Pichat 6/2, 40127 Bologna, Italy
Beatrice Fraboni
Affiliation:
Department of Physics and Astronomy, University of Bologna, Viale Berti Pichat 6/2, 40127 Bologna, Italy
Luca Magagnin
Affiliation:
Department of Chemistry, Materials and Chemical Engineering “Giulio Natta”, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy
Dario Gastaldi
Affiliation:
Department of Chemistry, Materials and Chemical Engineering “Giulio Natta”, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy
Pasquale Vena
Affiliation:
Department of Chemistry, Materials and Chemical Engineering “Giulio Natta”, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy
*
Address all correspondence to Martina Aurora Costa Angeli at [email protected]
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Abstract

Inkjet printing is a promising technology providing cost-effective method for processing various materials on deformable substrates. In this work, linear and serpentine inkjet printed interconnects on two different substrates were fabricated and electromechanically characterized. A particular attention was given to the optimization of the process parameters; high quality can be achieved only printing slowly in vertical direction and optimizing the drop spacing to the specific pattern. The electromechanical results showed that the geometrical layout and printing direction strongly affect the printing quality and the electromechanical response; serpentine shapes should be preferred to straight interconnects as better gauge factors are obtained.

Type
Research Letters
Information
MRS Communications , Volume 9 , Issue 1 , March 2019 , pp. 129 - 136
Copyright
Copyright © Materials Research Society 2019 

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