Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-30T10:41:26.187Z Has data issue: false hasContentIssue false
  • English
  • Français

Highly spherical, mono-sized SnAgCu droplets by pulsated orifice ejection method

Published online by Cambridge University Press:  14 August 2017

Bingge Zhao Open the ORCID record for Bingge Zhao [Opens in a new window] ,
Wei Dong ,
Huijun Ji ,
Quanliang Zhang ,
Ling Zhang ,
Mannan Wu ,
Qijie Zhai  and
Yulai Gao
Bingge Zhao
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Wei Dong*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, 2 Linggong Road, Dalian, Liaoning Province 116024, People's Republic of China
Huijun Ji
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Quanliang Zhang
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Ling Zhang
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Mannan Wu
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
Qijie Zhai
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China
Yulai Gao*
Affiliation:
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering, Shanghai University, Shanghai 200072, People's Republic of China Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200444, People's Republic of China
*
Address all correspondence to Wei Dong, Yulai Gao at [email protected], [email protected]
Address all correspondence to Wei Dong, Yulai Gao at [email protected], [email protected]
Get access

Abstract

Spherical Sn0.3Ag0.7Cu (wt.%) solder droplets with diameter ranging from 70.6 to 334.0 µm were prepared using pulsated orifice ejection method. Compared with conventional atomization, these droplets are almost completely spherical with a much narrower size distribution. The surface of these droplets is smooth without detectable satellite particles. Furthermore, both the composition and microstructure are homogenous throughout any single droplet regardless of their size. Detailed microstructural analysis shows that nano-sized Ag3Sn particles are distributed homogenously in the β-Sn matrix. The results suggest that the droplets have advantage as electronic packaging material and be a promising candidate material for three-dimensional printing.

Type
Research Letters
Information
MRS Communications , Volume 7 , Issue 3 , September 2017 , pp. 709 - 714
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Abtew, M. and Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng. R 27, 95 (2000).Google Scholar
2.Settle, D.M. and Patterson, C.C.: Lead in albacore: guide to lead pollution in Americans. Science 207, 1167 (1980).Google Scholar
3.Kinyanjui, R., Lehman, L.P., Zavalij, L. and Cotts, E.: Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys. J. Mater. Res. 20, 2914 (2011).Google Scholar
4.Anderson, I.E., Cook, B.A., Harringa, J.I. and Terpstra, R.L.: Sn–Ag–Cu solders and solder joints: alloy development, microstructure and properties. JOM 54, 26 (2002).Google Scholar
5.Anderson, I.E. and Harringa, J.L.: Elevated temperature aging of solder joints based on Sn–Ag–Cu: effects on joint microstructure and shear strength. J. Electron. Mater. 33, 1485 (2004).Google Scholar
6.Zhang, X., Yuan, Z., Zhao, H., Zang, L. and Li, J.: Wetting behavior and interfacial characteristic of Sn–Ag–Cu solder alloy on Cu substrate. Chin. Sci. Bull. 55, 797 (2010).Google Scholar
7.Henderson, D.W., Gosselin, T. and Sarkhel, A.: Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys. J. Mater. Res. 17, 2775 (2002).Google Scholar
8.Chuang, T.H., Tsao, L.C., Chung, C.-H. and Chang, S.Y.: Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging. Mater. Design 39, 475 (2012).Google Scholar
9.Lin, D.C., Srivatsan, T.S., Wang, G.X. and Kovacevic, R.: Microstructural development in a rapidly cooled eutectic Sn-3.5% Ag solder reinforced with copper powder. Powder Technol. 166, 38 (2006).Google Scholar
10.Dudek, M.A., Hunter, L., Kranz, S., Williams, J.J., Lau, S.H. and Chawla, N.: Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints. Mater. Charact. 61, 433 (2010).Google Scholar
11.Sundelin, J.J., Nurmi, S.T., Lepistö, T.K. and Ristolainen, E.O.: Mechanical and microstructural properties of SnAgCu solder joints. Mater. Sci. Eng. A 420, 55 (2006).Google Scholar
12.Minagawa, K., Kakisawa, H., Osawa, Y., Takamori, S. and Halada, K.: Production of fine spherical lead-free solder powders by hybrid atomization. Sci. Technol. Adv. Mater. 6, 325 (2005).Google Scholar
13.Kwon, Y.S., An, V.V., Ilyin, A.P. and Tikhonov, D.V.: Properties of powders produced by electrical explosions of copper–nickel alloy wires. Mater. Lett. 61, 3247 (2007).Google Scholar
14.Zou, C., Gao, Y., Yang, B. and Zhai, Q.: Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy. Mater. Charact. 61, 474 (2010).Google Scholar
15.Yagi, S., Ichitsubo, T., Matsubara, E., Yamaguchi, M., Kimura, H. and Sasamori, K.: Interfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additives. J. Alloy. Compd. 484, 185 (2009).Google Scholar
16.Miura, A., Dong, W., Fukue, M., Yodoshi, N., Takagi, K. and Kawasaki, A.: Preparation of Fe-based monodisperse spherical particles with fully glassy phase. J. Alloy. Compd. 509, 5581 (2011).Google Scholar
17.Chang, J., Hong, J. and Pak, J.J.: Self-arrangement of solder balls by using the surface wettability difference. Mater. Lett. 64, 1283 (2010).Google Scholar
18.Kim, J.O., Jung, J.P., Lee, J.H., Jeong, S. and Kang, H.S.: Effects of laser parameters on the characteristics of a Sn-3.5 wt.%Ag solder joint. Met. Mater – Int. 15, 119 (2009).Google Scholar
19.Kattner, U.R.: Phase diagram for lead-free solder alloys. JOM 54, 45 (2002).Google Scholar
20.Zhao, J., Gao, Y., Zhang, W., Song, T. and Zhai, Q.: Observation of the solidification microstructure of Sn3.5Ag droplets prepared by CDCA technique. J. Mater. Sci.: Mater. Electron. 23, 2221 (2012).Google Scholar
21.El-Daly, A.A., Fawzy, A., Mansour, S.F. and Younis, M.J.: Novel SiC nanoparticles-containing Sn-1.0Ag-0.5Cu solder with good drop impact performance. Mater. Sci. Eng. A 578, 62 (2013).Google Scholar
22.Fu, W., Song, X.G., Hu, S.P., Chai, J.H., Feng, J.C. and Wang, G.D.: Brazing copper and alumina metallized with Ti-containing Sn0.3Ag0.7Cu metal powder. Mater. Des. 87, 579 (2015).Google Scholar
23.El-Daly, A.A., El-Taher, A.M. and Dalloul, T.R.: Improved creep resistance and thermal behavior of Ni-doped Sn-3.0Ag-0.5Cu lead-free solder. J. Alloy. Compd. 587, 32 (2014).Google Scholar
24.Gong, J., Liu, C., Conway, P.P. and Silberschmidt, V.V.: Formation of Ag3Sn plates in SnAgCu solder bumps. Mater. Sci. Eng. A 527, 2588 (2010).Google Scholar
25.Swenson, D.: Lead-Free Electronic Solders (Springer, New York, USA, 2007), p. 42.Google Scholar
26.Moon, K.W., Boettinger, W.J., Kattner, U.R., Biancaniello, F.S. and Handwerker, C.A.: Experimental and thermodynamic assessment of Sn–Ag–Cu solder alloys. J. Electron. Mater. 29, 1122 (2000).Google Scholar
27.Ye, L., Lai, Z.H., Liu, J. and Thölén, A.: Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders. Solder. Surf. Mount Technol. 13, 16 (2001).Google Scholar
28.Kao, S., Lin, Y. and Duh, J.: Controlling intermetallic compound growth in SnAgCu Ni–P solder joints by nanosized Cu6Sn5 addition. J. Electron. Mater. 35, 486 (2006).Google Scholar
29.Gong, J., Liu, C., Conway, P.P. and Silberschmidt, V.V.: Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder. Scr. Mater. 61, 682 (2009).Google Scholar