Hostname: page-component-78c5997874-lj6df Total loading time: 0 Render date: 2024-11-03T04:04:03.713Z Has data issue: false hasContentIssue false
  • English
  • Français

Elucidating the kinetics of twin boundaries from thermal fluctuations

Published online by Cambridge University Press:  24 September 2013

Dengke Chen  and
Yashashree Kulkarni
Dengke Chen
Affiliation:
Department of Mechanical Engineering, University of Houston, Houston, Texas 77204
Yashashree Kulkarni*
Affiliation:
Department of Mechanical Engineering, University of Houston, Houston, Texas 77204
*
Address all correspondence to Yashashree Kulkarni at[email protected]
Get access

Abstract

There is compelling evidence for the critical role of twin boundaries (TBs) in imparting the extraordinary combination of strength and ductility to nanotwinned metals. Here, we investigate the thermal fluctuations of TBs in face-centered-cubic metals to elucidate the deformation mechanisms governing their kinetic properties using molecular dynamics simulations. Our results show that the TB motion is strongly coupled to shear deformation up to 0.95 homologous temperature. A rather unexpected observation is that coherent TBs do not exhibit any capillarity-induced fluctuations even at high temperatures, in sharp contrast to other high-angle grain boundaries.

Type
Research Letters
Information
MRS Communications , Volume 3 , Issue 4 , December 2013 , pp. 241 - 244
Copyright
Copyright © Materials Research Society 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Lu, L., Shen, Y., Chen, X., Qian, L., and Lu, K.: Ultrahigh strength and high electrical conductivity in copper. Science 304, 422 (2004).Google Scholar
2.Hodge, A.M., Wang, Y.M., and Barbee, T.W. Jr.: Mechanical deformation of high-purity sputter-deposited nano-twinned copper. Scr. Mater. 59, 163 (2008).Google Scholar
3.Jang, D., Li, X., Gao, H., and Greer, J.R.: Deformation mechanisms in nanotwinned metal nanopillars. Nature Nanotech. 7, 594 (2012).CrossRefGoogle ScholarPubMed
4.Cao, A.J., Wei, Y.G., and Mao, X.S.: Deformation mechanisms of face-centered-cubic metal nanowires with twin boundaries. Appl. Phys. Lett. 90, 151909 (2007).CrossRefGoogle Scholar
5.Asaro, R.J. and Kulkarni, Y.: Are rate sensitivity and strength effected by cross-slip in nano-twinned FCC metals. Scr. Mater. 58, 389 (2008).CrossRefGoogle Scholar
6.Zhu, T., Li, J., Samanta, A., Kim, H.G., and Suresh, S.: Interfacial plasticity governs strain rate sensitivity and ductility in nanostructured metals. Proc. Natl. Acad. Sci. USA 104 (2007).Google Scholar
7.Dao, M., Lu, L., Asaro, R.J., De Hossan, J.T.M., and Ma Li, E.: Toward a quantitative understanding of mechanical behavior of nanocrystalline metals. Acta Mater. 55, 4041 (2007).Google Scholar
8.Wolf, D., Yamakov, V., Phillpot, S.R., Mukherjee, A., and Gleiter, H.: Deformation of nanocrystalline materials by molecular-dynamics simulation: relationship to experiments? Acta Mater. 53, 1 (2005).CrossRefGoogle Scholar
9.Zhang, K., Weertman, J.R., and Eastman, J.A.: Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures. Appl. Phys. Lett. 87, 061921 (2005).Google Scholar
10.Sansoz, F. and Dupont, V.: Grain growth behavior at absolute zero during nanocrystalline metal indentation. Appl. Phys. Lett. 89, 111901 (2006).Google Scholar
11.Li, X., Wei, Y., Yang, W., and Gao, H.: Competing grain boundary and dislocation mediated mechanisms in plastic strain recovery in nanocrystalline aluminum. Proc. Natl. Acad. Sci. USA 106, 16108 (2009).Google Scholar
12.Shute, C.J., Myers, B.D., Xie, S., Barbee, T.W. Jr., Hodge, A.M., and Weertman, J.R.: Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins. Scr. Mater. 60, 1073 (2011).Google Scholar
13.Bezares, C.J., Jiao, S., Liuc, Y., Bufford, D., Lu, L., Zhang, X., Kulkarni, Y., and Asaro, R.J.: Indentation of Nano-Twinned FCC Metals: Implications for Nano-Twin Stability. Acta Mater. 60, 4623 (2012).Google Scholar
14.Safran, S.A.: Statistical Thermodynamics of Surfaces, Interface, and Membranes (Westview Press, Colorado, USA, 2003).Google Scholar
15.Hoyt, J.J., Trautt, Z.T., and Upmanyu, M.: Fluctuation in molecular dynamics simulation. Math. Comput. Simul. 80, 1382 (2010).CrossRefGoogle Scholar
16.Karma, A., Trautt, Z.T., and Mishin, Y.: Relationship between equilibrium fluctuations and shear-coupled motion of grain boundaries. Phys. Rev. Lett. 109, 095501 (2012).Google Scholar
17.Plimpton, S.J.: Fast parallel algorithms for short-range molecular dynamics. J. Comput. Phys. 117, 1 (1995).Google Scholar
18.Mishin, Y., Mehl, M.J., Papaconstantopoulos, D.A., Voter, A.F., and Kress, J.D.: Structural stability and lattice defects in copper: ab initio, tight-binding, and embedded atom calculations. Phys. Rev. B 63, 224106 (2001).Google Scholar
19.Hoty, J.J., Asta, M., Karma, A.: Method for computing the anisotropy of the solid- liquid interfacial free energy. Phys. Rev. Lett. 86, 5530 (2001).Google Scholar
20.Trautt, Z.T. and Upmanyu, M.: Direct two-dimensional calculations of grain boundary stiffness. Scr. Mater. 86, 5530 (2001).Google Scholar
21.Foiles, S.M. and Hoyt, J.J.: Computation of grain boundary stiffness and mobility from boundary fluctuations. Acta Mater. 54, 3351 (2006).Google Scholar
22.Hoyt, J.J., Trautt, Z.T., and Upmanyu, M.: Interface mobility from interface random walk. Science 314, 632 (2006).Google Scholar
23.Rottman, C.: Thermal fluctuation in low-angle grain boundary. Acta Metall. 34, 2465 (1986).CrossRefGoogle Scholar
24.Cahn, J.W., Mishin, Y., and Suzuki, A.: Coupling grain boundary motion to shear deformation. Acta Mater. 54, 4953 (2006).Google Scholar
25.Sinha, T. and Kulkarni, Y.: Anomalous deformation twinning in fcc metals at high temperatures. J. Appl. Phys. 109, 114315 (2011).Google Scholar