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Packaging Options for MEMS Devices

Published online by Cambridge University Press:  31 January 2011

Erik Jung
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Abstract

Microelectromechanical systems (MEMS) devices can be delicate structures sensitive to damage from handling or environmental influences. Their functionality may furthermore depend on sealing out the environment or being in direct contact with it. Stress, thermal load, and contaminants may change their characteristics. Here, packaging technology is challenged to extend from microelectronics toward MEMS and optoelectronic MEMS (MOEMS). Today's approaches rely on modified single-chip packages derived from the microelectronics industry, wafer-level capping to enable the device to be packaged like an integrated circuit, or highly specialized packages designed to complement the function of the MEMS device itself. Selecting the proper packaging method may tip the scale toward a product success or a product failure. Choosing the right technology, therefore, is a crucial part of the product design.

Keywords

microelectromechanical systems (MEMS)microelectronics packaging and integration
Type
Research Article
Information
MRS Bulletin , Volume 28 , Issue 1: Microelectronics Packaging and Integration , January 2003 , pp. 51 - 54
Copyright
Copyright © Materials Research Society 2003

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