Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Yon, J. J.
Mottin, E.
Biancardini, L.
Letellier, L.
and
Tissot, J. L.
2003.
Advanced Microsystems for Automotive Applications 2003.
p.
137.
Premachandran, C.S.
Chong, S.C.
Chai, T.C.
and
Iyer, M.
2004.
Vacuum packaging development and testing for an uncooled IR bolometer device.
p.
951.
Marinis, T.F.
Soucy, J.W.
Lawrence, J.G.
and
Owens, M.M.
2005.
Wafer level vacuum packaging of MEMS sensors.
Vol. 2,
Issue. ,
p.
1081.
Choa, Sung-Hoon
2005.
Reliability of MEMS packaging: vacuum maintenance and packaging induced stress.
Microsystem Technologies,
Vol. 11,
Issue. 11,
p.
1187.
Wang, Qian
Choa, Sung-Hoon
Kim, Woonbae
Hwang, Junsik
Ham, Sukjin
and
Moon, Changyoul
2006.
Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging.
Journal of Electronic Materials,
Vol. 35,
Issue. 3,
p.
425.
Wang, Qian
Choa, Sung Hoon
Kim, Woon Bae
Hwang, Jun Sik
Ham, Suk Jin
and
Moon, Chang Youl
2006.
Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding.
Key Engineering Materials,
Vol. 326-328,
Issue. ,
p.
609.
Shi, Qin
Qiu, Anping
Su, Yan
and
Zhu, Xinhua
2007.
Effects of Adhesive on Silicon Microgyroscopes.
p.
92.
Li, Yuanbo
and
Jiang, Zhibin
2008.
Handbook of Performability Engineering.
p.
953.
Lee, Chengkuo
and
Xie, Jin
2009.
Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path.
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,
Vol. 27,
Issue. 3,
p.
1267.
Garcia-Blanco, S.
LeFoulgoc, K.
Desroches, Y.
Caron, J.S.
Topart, P.
Alain, C.
and
Jerominek, H.
2009.
Wafer-level hermetic vacuum micro-packaging technology for IR detector applications.
p.
57.
Lee, Chengkuo
Lim, Ye Mei
Yang, Bin
Kotlanka, Rama Krishna
Heng, Chun-Huat
He, Johnny Han
Tang, Min
Xie, Jin
and
Feng, Hanhua
2009.
Theoretical comparison of the energy harvesting capability among various electrostatic mechanisms from structure aspect.
Sensors and Actuators A: Physical,
Vol. 156,
Issue. 1,
p.
208.
Lee, Chengkuo
Yu, Aibin
Yan, Liling
Wang, Haitao
He, Johnny Han
Zhang, Qing Xin
and
Lau, John H.
2009.
Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging.
Sensors and Actuators A: Physical,
Vol. 154,
Issue. 1,
p.
85.
Choa, Sung-Hoon
2009.
Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect.
Microsystem Technologies,
Vol. 15,
Issue. 5,
p.
677.
Yu, Da-Quan
Lee, Chengkuo
Yan, Li Ling
Thew, Meei Ling
and
Lau, John H.
2009.
Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization.
Journal of Alloys and Compounds,
Vol. 485,
Issue. 1-2,
p.
444.
Feng, Rui
Qiu, An Ping
Shi, Qin
Zhu, Xin Hua
Yang, Liang
and
Su, Yan
2010.
A Research on Temperature Dependent Characteristics of Quality Factor of Silicon MEMS Gyroscope.
Advanced Materials Research,
Vol. 159,
Issue. ,
p.
399.
Byung-Gil Jeong
Suk-Jin Ham
Chang-Youl Moon
and
Byung-Sung Kim
2010.
Reliability Verification of Hermetic Package With Nanoliter Cavity for RF-Micro Device.
IEEE Transactions on Advanced Packaging,
Vol. 33,
Issue. 1,
p.
64.
Xu, Dehui
Xiong, Bin
and
Wang, Yuelin
2011.
Micromachined Thermopile IR Detector Module With High Performance.
IEEE Photonics Technology Letters,
Vol. 23,
Issue. 3,
p.
149.
Lee, Chengkuo
and
Pitchappa, Prakash
2012.
Autonomous Sensor Networks.
Vol. 13,
Issue. ,
p.
265.
Kang, Seok Jin
Moon, Young Soon
Son, Won Ho
and
Choi, Sie Young
2014.
Vacuum-controlled wafer-level packaging for micromechanical devices.
Japanese Journal of Applied Physics,
Vol. 53,
Issue. 6,
p.
066501.
Cao, Haishan
Vermeer, Cristian H.
Vanapalli, Srinivas
Holland, Harry J.
and
ter Brake, H. J. Marcel
2015.
Long-life micro vacuum chamber for a micromachined cryogenic cooler.
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films,
Vol. 33,
Issue. 6,