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High-Performance Packaging of Power Electronics

Published online by Cambridge University Press:  31 January 2011

M. C. Shaw
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Abstract

Packaging of solid-state power electronics is a highly interdisciplinary process requiring knowledge of electronics, heat transfer, mechanics, and materials science. Consequently, there are numerous opportunities for innovations at the interfaces of these complementary fields. This article offers a perspective of the current state of the art and identifies six specific areas for materials-based research in power electronics packaging. The emphasis is on identifying the underlying physical relationships that link the performance of the power electronics system to the microstructure and architectural arrangement of the constituents.

Keywords

microelectronics packaging and integrationfracturelayered structuresstructural materials
Type
Research Article
Information
MRS Bulletin , Volume 28 , Issue 1: Microelectronics Packaging and Integration , January 2003 , pp. 41 - 50
Copyright
Copyright © Materials Research Society 2003

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