Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-23T12:40:01.147Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermal stress in a polymer-coated optical glass fiber with a low-modulus coating at the ends

Published online by Cambridge University Press:  31 January 2011

E. Suhir
E. Suhir
Affiliation:
Bell Laboratories, Lucent Technolgies, Inc., 600 Mountain Ave., Room 1D-443, Murray Hill, New Jersey 07974
Get access

Abstract

A polymer-coated glass fiber with a low-modulus coating at the ends is considered. The objective of the analysis is to find out if there is sufficient incentive to use such a dual coating system for lower interfacial thermally induced stresses. These are due to the different coefficients of thermal expansion (contraction) of the dissimilar materials in the trimaterial structure. The study is restricted to the evaluation of the shearing stresses only and is based on a simplified strength-of-materials model, rather than on a rigorous theory-of-elasticity method. Such a approach seems to be justified, since the most accurate predictions of the magnitude and the distribution of the induced stresses are beyond the scope of this analysis. On the basis of the calculated data, we conclude that there is a definite incentive for employing a bimaterial coating system, in which “conventional” (high modulus) polymeric material is used in the midportion of the fiber, while a low-modulus material (typically, with a higher coefficient of expansion) is applied at its ends. Such a system could be recommended, when there is a need to bring down the interfacial stresses, and the possible increase in the manufacturing cost is not viewed as an obstacle.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 10 , October 2001 , pp. 2996 - 3004
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Devadoss, E., J. Sci. Ind. Res. 51, (1992).Google Scholar
2Rayss, J., Podkoscielny, W.M., Gorgol, A., Widomski, J., and Ryczkowski, J., J. Appl. Polym. Sci. 57, (1995).CrossRefGoogle Scholar
3Hattori, T., Urano, A., Akasaka, N., and Matsuda., Y., in Proc. of the 44th Int. Wire and Cable Symposium (1995).Google Scholar
4Wojcik, A.B., Matthewson, M.J., Klein, L.C., Foy, P.R., Snitzer, E., and Wong, K.P., Proc. SPIE 2611, (1996).Google Scholar
5Matejec, V., Rose, K., Hayer, M., Pospilova, M., and Chomat, M., Sens. Actuators, B 39, (1997).Google Scholar
6Rayss, J., Podkoscielny, W.M., Gorgol, A., and Widomski, J., Proc. SPIE 3189, (1997)Google Scholar
7Rayss, J., Widomski, J., Luzinov, I., Voronov, A., and Minko, S., Appl, J.. Polym. Sci. 67, (1998).Google Scholar
8Matejec, V., Hayer, M., Pavlovic, P., Kubeckova, M., Kunkova, G., and Guglielmi, M., J. Sol-Gel Sci Technol. 5, (1995).CrossRefGoogle Scholar
9Gebizioglu, O.S. and Plitz, I.M., Opt. Eng. 30, (1991).Google Scholar
10King, W.W. and Aloisio, C.J., ASME J. Electron. Packag. 119, (1997).CrossRefGoogle Scholar
11Shiue, S.T. and Lee, S.B., J. Appl. Phys. 72, (1992).Google Scholar
12Shiue, S.T., IEEE Photonics Technol Lett. 4, (1992).CrossRefGoogle Scholar
13Shiue, S.T., J. Appl. Phys. 76, (1994).Google Scholar
14Shiue, S.T., Chin. Inst. Eng. 17, (1994).Google Scholar
15Shiue, S.T., Mater. Chem. Phys. 38, (1994).Google Scholar
16Cocchini, F., Polym. Eng. Sci. 34, (1994).CrossRefGoogle Scholar
17Suhir, E., Int. J. Solids Struct. 27, (1991).CrossRefGoogle Scholar
18Suhir, E., ASME J. Appl. Mech. 53, (1986).CrossRefGoogle Scholar