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Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections

Published online by Cambridge University Press:  31 January 2011

Jong-Hyun Lee ,
Jong-Hwan Park ,
Yong-Ho Lee ,
Yong-Seog Kim  and
Dong Hyuk Shin
Jong-Hyun Lee
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Jong-Hwan Park
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Yong-Ho Lee
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Yong-Seog Kim
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Dong Hyuk Shin
Affiliation:
Department of Metallurgy and Materials Science, Hanyang University, Ansan 425-791, Kyungki-Do, Korea
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Abstract

The thermodynamic stability of the solder channels at a scalloplike Cu6Sn5 layer formed between Sn-containing solders and Cu substrate was evaluated by studying the penetration behavior of the liquid solders into the grain boundaries of a Cu6Sn5 substrate. The orientational relationship between the grains of the Cu6Sn5 layer formed during reflow soldering was also analyzed using the electron backscattered diffraction technique. The results showed that liquid solders penetrate into the grain boundaries at an order of faster speed than the growth rate of the layer, which provided a direct evidence of thermodynamic stability of the channel.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 16 , Issue 5 , May 2001 , pp. 1227 - 1230
Copyright
Copyright © Materials Research Society 2001

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