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Local Cross-sectional Profiling of Multilayer Thin Films with an Atomic Force Microscope for Layer Thickness Determination

Published online by Cambridge University Press:  31 January 2011

J. R. LaGraff
Affiliation:
Superconducting Electronics Organization, TRW Space and Defense, One Space Park Drive, Redondo Beach, California 90278
J. M. Murduck
Affiliation:
Superconducting Electronics Organization, TRW Space and Defense, One Space Park Drive, Redondo Beach, California 90278
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Abstract

A new essentially nondestructive cross-sectional method is described for measuring the individual thicknesses of multilayer YBa2Cu3O7 (YBCO) and SrTiO3 (STO) thin films using off-axis ion milling and the atomic force microscope (AFM). Since the ion-milling is done during routine patterning of a thin-film device and the AFM requires only a small area for imaging, no additional sample preparation is required. This is a significant improvement over traditional cross-sectional techniques which often require lengthy and destructive sample preparation. Also, there is no a priori reason that this technique would not be amenable to other multilayer thin-film systems.

Type
Articles
Copyright
Copyright © Materials Research Society 1997

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References

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