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Indentation plastic displacement field: Part II. The case of hard films on soft substrates

Published online by Cambridge University Press:  31 January 2011

T. Y. Tsui*
Affiliation:
Advanced Micro Devices, One AMD Place, Sunnyvale, California 94088
Joost Vlassak
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
William D. Nix
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
*
a)Address all correspondence to this author. e-mail: [email protected].
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Abstract

The plastic displacements around Knoop indentations made in hard titanium/aluminum multilayered films on soft aluminum alloy substrates have been studied. Indentations were cross-sectioned and imaged using focused-ion-beam (FIB) milling and high-resolution scanning electron microscopy (SEM), respectively. The FIB milling method has the advantage of removing material in a localized region without producing mechanical damage to the specimen. The micrographs of the cross-sectioned indentations indicate that most of the plastic deformation around the indentation is dominated by the soft aluminum substrate. There is a very small change in the multilayered film thickness around the indentation—less than 10%. The plastic deformation of the thin film resembles a membrane being deflected by a localized pressure gradient across the membrane. Stress-induced voids are also observed in the multilayered film, especially in the area around the indentation apex. The density and the size of the voids increase with indentation depth. Indentation sink-in effects are observed in all of the indentations inspected. Based on the experimental results, the amount of sink-in of the hard film–soft substrate composite is larger than the bulk substrate and film alone. This is confirmed by the finite element analyses conducted in this work.

Type
Articles
Copyright
Copyright © Materials Research Society 1999

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