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Effect of process variables on the structure, residual stress, and hardness of sputtered nanocrystalline nickel films

Published online by Cambridge University Press:  31 January 2011

R. Mitra ,
R. A. Hoffman ,
A. Madan  and
J. R. Weertman
R. Mitra
Affiliation:
Defence Metallurgical Research Laboratory, Kanchanbagh, Hyderabad 500 058, India
R. A. Hoffman
Affiliation:
Advanced Coating Technology Group, Northwestern University, Evanston, Illinois 60208
A. Madan
Affiliation:
Advanced Coating Technology Group, Northwestern University, Evanston, Illinois 60208
J. R. Weertman
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208

Abstract

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Nanocrystalline nickel films of about 0.1 μm thickness grown by sputtering with and without substrate bias possessed average grain sizes of 9–25 nm. Variation in substrate bias at room and liquid nitrogen temperature of deposition strongly affected grain structure and size distribution. Qualitative studies of film surfaces showed variation in roughness and porosity level with substrate bias and film thickness (maximum of 8 μm). The films had tensile residual stress, which varied with deposition conditions. The hardness values were much higher than those of coarse-grained nickel but decreased with an increase in the film thickness because of grain growth.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 4 , April 2001 , pp. 1010 - 1027
Copyright
Copyright © Materials Research Society 2001

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