Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-26T13:38:24.288Z Has data issue: false hasContentIssue false

Impacts of postannealing ambient atmospheres on Pt/SrBi2.2Ta2O9/Pt capacitors

Published online by Cambridge University Press:  31 January 2011

Ai-Dong Li
Affiliation:
Materials Science and Engineering Department, Nanjing University, Nanjing 210093, People's Republic of China; National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People's Republic of China
Tao Yu
Affiliation:
National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People's Republic of China
Hui-Qin Ling
Affiliation:
Materials Science and Engineering Department, Nanjing University, Nanjing 210093, People's Republic of China; National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People's Republic of China
Di Wu
Affiliation:
Materials Science and Engineering Department, Nanjing University, Nanjing 210093, People's Republic of China; National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People's Republic of China
Zhi-Guo Liu
Affiliation:
National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People's Republic of China; Center for Advanced Studies in Science and Technology of Microstructures, Nanjing University, Nanjing 210093, People's Republic of China
Nai-Ben Ming
Affiliation:
National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People's Republic of China; Center for Advanced Studies in Science and Technology of Microstructures, Nanjing University, Nanjing 210093, People's Republic of China
Get access

Abstract

SrBi2Ta2O9 (SBT) films were prepared on Pt/TiO2/SiO2/Si substrates at 750 °C in oxygen by the metalorganic decomposition method. SBT film capacitors were postannealed in Ar (N2) at 350–750 °C and then reannealed in O2 at 750 °C. Effects of annealing atmosphere on the structure, morphology, and ferroelectric properties have been investigated systematically. The composition analyses indicate Ar- or N2-annealing at 750 °C leads to Bi evaporation and oxygen loss. Above 550 °C 100% Ar or N2 postannealing, the remnant polarization decreases and the coercive field increases significantly. The subsequent O2 recovery can hardly rejuvenate the electrical properties. The result is different from that with the effective O2 recovery in forming gas processing (annealing in an atmosphere containing 5% hydrogen). The possible origin and mechanism is discussed and proposed.

Type
Articles
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Araujo, C.A., Cuchlaro, J.D., McMillan, L.D., Scott, M.C., and Scott, J.F., Nature 374, 627 (1995).CrossRefGoogle Scholar
2.Kato, K., Jpn. J. Appl. Phys. 37, 5178 (1998).CrossRefGoogle Scholar
3.Joshi, P.C., Ryu, S.O., Zhang, X., and Desu, S.B., Appl. Phys. Lett. 70, 1080 (1997)CrossRefGoogle Scholar
4.Zafar, S., Kaushik, V., Laberge, P., Chu, P., Jones, R.E., Hance, R.L., Zurcher, P., White, B.E., Tayer, D., Melnick, B., and Gillespie, S., J. Appl. Phys. 82, 4469 (1997).CrossRefGoogle Scholar
5.Hase, T., Noguchi, T., and Miyasaka, Y., Integr. Ferroelectr. 16, 29 (1997).CrossRefGoogle Scholar
6.Kwon, O.S. and Hwang, C.S., Appl. Phys. Lett. 75, 558 (1999).CrossRefGoogle Scholar
7.Yu, T., Wang, D.S., Wu, D., Li, A.D., Zhu, X.H., Hu, A., Liu, Z.G., and Ming, N.B., Integ. Ferroelectr. 31, 333 (2000).CrossRefGoogle Scholar
8.Li, A.D., Wu, D., Ling, H.Q., Yu, T., Wang, M., Yin, X.B., Liu, Z.G., and Ming, N.B., J. Appl. Phys. 88, 1035 (2000).CrossRefGoogle Scholar
9.Song, T.K., Lee, J.K., and Jung, H.J., Appl. Phys. Lett. 71, 3839 (1996).CrossRefGoogle Scholar
10.Atsuki, T., Soyama, N., Yonezawa, T., Yonezawa, T., and Ogi, K., Jpn. J. Appl. Phys. 34, 5096 (1995).CrossRefGoogle Scholar
11.Seong, N.J., Yang, C.H., Shin, W.C., and Yoon, S.G., Appl. Phys. Lett. 72, 1374 (1998).CrossRefGoogle Scholar
12.Wu, D., Li, A.D., Ling, H.Q., Yu, T., Liu, Z.G., and Ming, N.B., J. Appl. Phys. 87, 1795 (2000).CrossRefGoogle Scholar
13.Li, A.D., Wu, D., Ling, H.Q., Yu, T., Wang, M., Yin, X.B., Liu, Z.G., and Ming, N.B., Thin Solid Films 375, 215 (2000).CrossRefGoogle Scholar
14.Li, A.D., Wu, D., Ling, H.Q., Liu, Z.G., and Ming, N.B., Appl. Phys. A (submitted for publication).Google Scholar
15.Reed, S.G., Electron Microprobe Analysis (Cambridge University Press, Cambridge, United Kingdom, 1975), p. 223.Google Scholar
16.Chen, P.C., Miki, H., Shimamoto, Y., and Matsui, Y., Jpn. J. Appl. Phys. 37, 5112 (1998).CrossRefGoogle Scholar
17.Chen, T.C., Li, T., Zhang, X., and Desu, S.B., J. Mater. Res. 12, 2165 (1997).CrossRefGoogle Scholar
18.Wu, D., Li, A.D., Ling, H.Q., Yu, T., Liu, Z.G., and Ming, N.B., Appl. Phys. Lett. 76, 2208 (2000).CrossRefGoogle Scholar
19.Dimos, D., Warren, W.L., and Tuttle, B.A., in Ferroelectric Thin Films III, edited by Myers, E.R., Tuttle, B.A., Desu, S.B., and Larsen, P.K. (Mater. Res. Soc. Symp. Proc. 310, Pittsburgh, PA, 1993), p. 87.Google Scholar
20.Al-Shareef, H.N., Dimos, D., Boyle, T.J., Warren, W.L., and Tuttle, B.A., Appl. Phys. Lett. 68, 690 (1996).CrossRefGoogle Scholar
21.Dimos, D., Al, H.A.-Shareef, Warren, W.L., and Tuttle, B.A., J. Appl. Phys. 80, 1682 (1996).CrossRefGoogle Scholar