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Effect of lead content on vibration fracture behavior of Pb–Sn eutectic solder

Published online by Cambridge University Press:  31 January 2011

C. M. Chuang ,
T. S. Lui  and
L. H. Chen
C. M. Chuang
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan, Republic of China
T. S. Lui*
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan, Republic of China
L. H. Chen
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan, Republic of China
*
a)Address all correspondence to this author.[email protected]
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Abstract

According to resonant vibration fatigue tests, near-eutectic and Pb-rich hypoeutectic Pb–Sn specimens have higher crack-propagation resistance. The tensile flow stress of Pb–Sn solders that are near eutectic composition increases with decreasing Pb content. The solders were tested after either stabilizing at 373 K or natural aging for 20 days, which gave similar results. The naturally aged specimens show that the crack-propagation resistance increases with increasing aging time. A striated deformation was found to occur in Sn grain of the lower Pb specimen. This phenomenon is correlated with a deterioration of crack-propagation resistance.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 9 , September 2001 , pp. 2644 - 2652
Copyright
Copyright © Materials Research Society 2001

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