Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-23T14:05:20.775Z Has data issue: false hasContentIssue false

Direct writing of polymer thick film resistors using a novel laser transfer technique

Published online by Cambridge University Press:  31 January 2011

R. Modi*
Affiliation:
Department of Mechanical and Aerospace Engineering, The George Washington University, Washington, DC 20052, and Naval Research Laboratory, Code 6372, Washington, DC 20052
H. D. Wu
Affiliation:
SFA, Inc., Largo, Maryland 20774 and Naval Research Laboratory, Code 6372, Washington, DC 20052
R. C. Y. Auyeung
Affiliation:
Naval Research Laboratory, Code 6372, Washington, DC 20052
C. M. Gilmore
Affiliation:
Department of Mechanical and Aerospace Engineering, The George Washington University, Washington, DC 20052, and Naval Research Laboratory, Code 6372, Washington, DC 20052
D. B. Chrisey
Affiliation:
Naval Research Laboratory, Code 6372, Washington, DC 20052
*
a) Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Polymer thick film (PTF) resistors were fabricated using a new laser-based transfer technique called matrix-assisted pulsed laser evaporation direct write (MAPLE-DW). MAPLE-DW is a versatile direct writing technique capable of writing a wide variety of materials on virtually any substrate in air and at room temperature. Epoxy-based PTF resistors spanning four decades of sheet resistances (10 Ω/sq. to 100 kΩ/sq.) were deposited on alumina substrates under ambient conditions. Electrical characteristics of these MAPLE-DW deposited resistors were studied at a wide frequency range (1 MHz to 1.8 GHz), and the results were explained through an equivalent circuit model and impedance spectroscopy. Temperature coefficient of resistance measurements for the PTF resistors were performed between 25 and 125 °C. The results based on the percolation theory were used to explain the temperature dependence of the resistance behavior of the PTF resistors.

Type
Articles
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Licari, J.J. and Enlow, L.R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing, and Produc-tion, 2nd ed. (Noyes Publications, Park Ridge, NJ, 1998).Google Scholar
2.Hybrid Microelectronics Handbook, edited by Sergent, J.E. and Harper, C.A. (McGraw Hill, New York, 1995).Google Scholar
3.Borland, W., Electronics Materials Handbook: Packaging (ASM International, Materials Park, OH, 1989), p. 332.Google Scholar
4.Rose, A., Electrocomponent Science and Technology 9, 43 (1981).CrossRefGoogle Scholar
5.West, R.A., in Ceramic Materials for Electronics: Processing, Properties, and Applications, 2nd ed., edited by Buchanan, R.C. (Marcel Dekker, New York, 1991), p. 435.Google Scholar
6.Xiao, A.Y., Tong, Q.K., and Savoca, A.C., IEEE Components and Technology Conference, New York, 1999, p. 88 (1988).Google Scholar
7.Vasudevan, S. and Shaikh, A., ISHM ’93 Proc., p. 685 (1993).Google Scholar
8.Jupina, M.A., El-Beyrouty, C., Amey, D.I., and Walker, A.T., 1999 International Symposium on Microelectronics, p. 94 (1999).Google Scholar
9.Gilleo, K., Polymer Thick Film (Van Nostrand Reinhold, New York, 1996).Google Scholar
10.Fu, S-L., Liang, M-S., Shiramatsu, T., and Wu, T-S., IEEE Transac-tions on Components, Hybrids, and Manufacturing Technology, CHMT-4(3), 283 (1981).Google Scholar
11.Fu, S-L., IEEE Transactions on Components, Hybrids, and Manu-facturing Technology, CHMT–4(3), 289 (1981).Google Scholar
12.Dziedzic, A., Proc. of 21st International Conference on Microelec-tronics (MIEL’97), 1, p. 427 (1997).Google Scholar
13.Chrisey, D.B., Piquè, A., Fitz-Gerald, J., ’Auyeung, R.C.Y., McGill, R.A., Wu, H.D., and Duignan, M., Appl. Surf. Sci. 154–155, 593 (2000).CrossRefGoogle Scholar
14.Piquè, A., Chrisey, D.B., Auyeung, R.C.Y., Fitz-Gerald, J., Wu, H.D., McGill, R.A., Lakeou, S., Wu, P.K., Nguyen, V., and Duignan, M., Appl. Phys. A (Suppl) S279 (1999).Google Scholar
15.Piquè, A., McGill, R.A., Chrisey, D.B., Leonhardt, D., Mslna, T.E., Spargo, B.J., Callahan, J.H., Vachet, R.W., Chung, R., and Bucaro, M.A., Thin Solid Films 355–356, 536 (1999).CrossRefGoogle Scholar
16.Bohandy, J., Kim, B.F., Adrian, F.J., and Jette, A.N., J. Appl. Phys. 63, 1158 (1988).CrossRefGoogle Scholar
17.Adrian, F.J., Bohandy, J., Kim, B.F., Jette, A.N., and Thomson, P., J. Vac. Sci. Technol., B 5, 1490 (1987).CrossRefGoogle Scholar
18.Esrom, H., Zhang, J-Y., Kogelschatz, U., and Pedraza, A.J., Appl. Surf. Sci. 86, 202 (1995).CrossRefGoogle Scholar
19.Kántor, Z., Tóth, Z., and Szörènyi, T., Appl. Phys. A 54, 170 (1992).CrossRefGoogle Scholar
20.Kántor, Z., Tóth, Z., and Szörènyi, T., Appl. Surf. Sci. 86, 196 (1995).CrossRefGoogle Scholar
21.Chiou, B-S., Hsu, W-Y., and Duh, J-G., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15, 393 (1992).CrossRefGoogle Scholar
22.Pike, G.E. and Seager, C.H., J. Appl. Phys. 48, 5152 (1977).CrossRefGoogle Scholar
23.Kawamoto, H., in Carbon-Black Polymer Composites, edited by Sichel, E.K. (Marcel Dekker, New York, 1982), p. 135.Google Scholar
24.Gupta, T.K., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12, (New York, NY) 696 (1989).CrossRefGoogle Scholar
25.Miller, A. and Abrahams, E., Phys. Rev. 120, 745 (1960).CrossRefGoogle Scholar
26.Sichel, E.K., Gittleman, J.I., and Sheng, P., in Carbon-Black Poly-mer Composites, edited by Sichel, E.K. (Marcel Dekker, New York, 1982), p. 51.Google Scholar