Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Merabet, A.
Haddab, Y.
and
Gontrand, C.
1992.
Procédés thermiques rapides pour la fabrication de structures bipolaires dédiées à la ULSI.
Physica Status Solidi (a),
Vol. 134,
Issue. 2,
p.
359.
Solmi, S.
Valmorri, S.
and
Canteri, R.
1995.
Codiffusion of arsenic and boron implanted in silicon.
Journal of Applied Physics,
Vol. 77,
Issue. 6,
p.
2400.
Armigliato, A.
Romanato, F.
Drigo, A.
Carnera, A.
Brizard, C.
Regnard, J. R.
and
Allain, J. L.
1995.
Anomalous low-temperature dopant diffusivity and defect structure in Sb- and Sb/B-implanted annealed silicon samples.
Physical Review B,
Vol. 52,
Issue. 3,
p.
1859.
Solmi, S.
and
Valmorri, S.
1995.
Experimental Results and Modeling of the Codiffusion of Donors and Acceptors in Si.
MRS Proceedings,
Vol. 389,
Issue. ,
Revenant-Brizard, C.
Regnard, J. R.
Solmi, S.
Armigliato, A.
Valmorri, S.
Cellini, C.
and
Romanato, F.
1996.
High-temperature annealings of Sb and Sb/B heavily implanted silicon wafers studied by near grazing incidence fluorescence extended x-ray absorption fine structure.
Journal of Applied Physics,
Vol. 79,
Issue. 12,
p.
9037.
Kozlov, I P
Odzhaev, V B
Popok, V N
and
Hnatowicz, V
1996.
Annealing of radiation defects in dual-implanted silicon.
Semiconductor Science and Technology,
Vol. 11,
Issue. 5,
p.
722.
Solmi, S.
and
Canteri, R.
1997.
Formation of Counter Doped Shallow Junctions by Boron and Antimony Implantation and Codiffusion in Silicon.
MRS Proceedings,
Vol. 469,
Issue. ,
Uesugi, F.
Kikuchi, Y.
Watanabe, K.
and
Hoshimoto, I.
1998.
Residual defects in low energy and low dose antimony ion-implanted silicon.
Journal of Applied Physics,
Vol. 83,
Issue. 10,
p.
5159.
Solmi, Sandro
1998.
Counterdoped very shallow p+/n junctions obtained by B and Sb implantation and codiffusion in Si.
Journal of Applied Physics,
Vol. 83,
Issue. 3,
p.
1742.
Solmi, S.
and
Bersani, M.
2000.
Effects of donor concentration on transient enhanced diffusion of boron in silicon.
Journal of Applied Physics,
Vol. 87,
Issue. 8,
p.
3696.
Tishkovskii, E. G.
Obodnikov, V. I.
Taskin, A. A.
Feklistov, K. V.
and
Seryapin, V. G.
2000.
Redistribution of phosphorus implanted into silicon doped heavily with boron.
Semiconductors,
Vol. 34,
Issue. 6,
p.
629.
Takamura, Yayoi
Vailionis, Arturas
Marshall, Ann F.
Griffin, Peter B.
and
Plummer, James D.
2002.
Dopant deactivation in heavily Sb doped Si (001): A high-resolution x-ray diffraction and transmission electron microscopy study.
Journal of Applied Physics,
Vol. 92,
Issue. 9,
p.
5503.
Solmi, S.
Ferri, M.
Bersani, M.
Giubertoni, D.
and
Soncini, V.
2003.
Transient enhanced diffusion of arsenic in silicon.
Journal of Applied Physics,
Vol. 94,
Issue. 8,
p.
4950.
Moon, Chang-Youn
Kim, Yong-Sung
and
Chang, K. J.
2004.
Atomic structure of B-related defects and B diffusion in Si predoped with P impurities.
Physical Review B,
Vol. 69,
Issue. 8,
Pichler, Peter
2004.
Intrinsic Point Defects, Impurities, and Their Diffusion in Silicon.
p.
331.
Merabet, A.
2005.
Simulations of arsenic and boron co-implanted in silicon during RTA for ultra-shallow junctions realizations.
Materials Science and Engineering: B,
Vol. 124-125,
Issue. ,
p.
419.
Glitzky, A.
and
Hünlich, R.
2005.
Global Existence Result for Pair Diffusion Models.
SIAM Journal on Mathematical Analysis,
Vol. 36,
Issue. 4,
p.
1200.
Merabet, A.
and
Marcon, J.
2006.
The effect of arsenic fluence on the boron diffusion in the polysilicon on monosilicon during rapid thermal annealing.
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms,
Vol. 253,
Issue. 1-2,
p.
122.
Jwa, Sanghun
Bang, Junhyeok
and
Chang, K. J.
2009.
Chemical bonding and diffusion of B dopants in C-predoped Si.
Physical Review B,
Vol. 80,
Issue. 7,
Kanungo, PratyushDas
Kögler, Reinhard
Werner, Peter
Gösele, Ulrich
and
Skorupa, Wolfgang
2010.
A Novel Method to Fabricate Silicon Nanowire p–n Junctions by a Combination of Ion Implantation and in-situ Doping.
Nanoscale Research Letters,
Vol. 5,
Issue. 1,