Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-22T19:10:19.540Z Has data issue: false hasContentIssue false
  • English
  • Français

Wireless multi-gigabit data transmission using active MMIC components at 220 GHz

Published online by Cambridge University Press:  15 March 2012

Jochen Antes ,
Daniel Lopez-Diaz ,
Axel Tessmann ,
Arnulf Leuther ,
Hermann Massler ,
Thomas Zwick ,
Oliver Ambacher  and
Ingmar Kallfass
Jochen Antes*
Affiliation:
Karlsruhe Institute of Technology, Institut für Hochfrequenztechnik und Elektronik, D-76131 Karlsruhe, Germany Phone: + 49 721 608 45101.
Daniel Lopez-Diaz
Affiliation:
Fraunhofer Institute for Applied Solid State Physics (IAF), D-79108 Freiburg, Germany.
Axel Tessmann
Affiliation:
Fraunhofer Institute for Applied Solid State Physics (IAF), D-79108 Freiburg, Germany.
Arnulf Leuther
Affiliation:
Fraunhofer Institute for Applied Solid State Physics (IAF), D-79108 Freiburg, Germany.
Hermann Massler
Affiliation:
Fraunhofer Institute for Applied Solid State Physics (IAF), D-79108 Freiburg, Germany.
Thomas Zwick
Affiliation:
Karlsruhe Institute of Technology, Institut für Hochfrequenztechnik und Elektronik, D-76131 Karlsruhe, Germany Phone: + 49 721 608 45101.
Oliver Ambacher
Affiliation:
Fraunhofer Institute for Applied Solid State Physics (IAF), D-79108 Freiburg, Germany.
Ingmar Kallfass
Affiliation:
Karlsruhe Institute of Technology, Institut für Hochfrequenztechnik und Elektronik, D-76131 Karlsruhe, Germany Phone: + 49 721 608 45101. Fraunhofer Institute for Applied Solid State Physics (IAF), D-79108 Freiburg, Germany.
*
Corresponding author: J. Antes Email: [email protected]
Get access Rights & Permissions [Opens in a new window]

Abstract

In this paper we present a wireless data link for multi-gigabit transmission in the mmW frequency range. The link is realized using waveguide modules based on fully integrated 50 nm metamorphic high electron mobility transistor (mHEMT) transmit and receive millimeter wave monolithic integrated circuits (MMICs) and provides transmission of data rates up to 12.5 Gbit/s modulated on a 220 GHz carrier. The receiver input sensitivity is characterized down to values of −38.6 dBm and shows an error rate of 3.0 × 10−9. Measurements using a coherent link setup show bit error rates better than 1.6 × 10−9 for a data rate of 10 Gbit/s and a transmission distance of 2 m. For a distance of 20 m a real-time Digital Video Broadcasting – Satellite (DVB-S) television transmission is realized. The signal quality after the wireless link is sufficient for a commercial DVB-S receiver to display the television programs.

Keywords

Wireless Systems and Signal Processing (SDR, MIMO, UWB, etc.)Circuit design and applications
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 4 , Special Issue 3: European Microwave Week 2011 , June 2012 , pp. 291 - 298
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]Jastrow, C. et al. : Wireless digital data transmission at 300 GHz. Electron. Lett., 46(9) (2010), 661–663.CrossRefGoogle Scholar
[2]Kukutsu, N. et al. : 10-Gbit/s wireless link systems using the 120-GHz band, in IEEE Antennas and Propagation Society Int. Symp., 2008. San Diego, California, U.S., AP-S 2008. July 2008, 1–4.Google Scholar
[3]Yamaguchi, R. et al. : 10-Gbit/s MMIC wireless link exceeding 800 meters, in 2008 IEEE Radio and Wireless Symp., Orland, Orlando, U.S., January 2008, 695–698.Google Scholar
[4]Song, H.-J. et al. : Multi-gigabit wireless data transmission at over 200-GHz, in 34th Int. Conf. on Infrared, Millimeter, and Terahertz Waves, 2009. Busan, Korea, IRMMW-THz 2009. September 2009, 1–2.Google Scholar
[5]Song, H.-J. et al. : Terahertz wireless communication link at 300 GHz, in 2010 IEEE Topical Meeting on Microwave Photonics (MWP), Montreal, Quebec, Canada, October 2010, pp. 42–45.Google Scholar
[6]Leuther, A. et al. : 50 nm MHEMT Technology for G- and H-Band MMICs, in IEEE 19th Int. Conf. on Indium Phosphide Related Materials, 2007. Matsue, Japan, IPRM'07, May 2007, 24–27.Google Scholar
[7]Tessmann, A. et al. : High-gain submillimeter-wave mHEMT amplifier MMICs, in 2010 IEEE MTT-S Int. Microwave Symp. Digest (MTT), Anaheim, California, U.S., May 2010, 53–56.Google Scholar
[8]Kallfass, I. et al. : Wireless DVB-C transmission at 220 GHz using active single-chip receive and transmit MMICs, in 2011 IEEE MTT-S Int. Microwave Symp. Digest (MTT) Baltimore, MD, U.S., June 2011, 1–4.Google Scholar
[9]Kallfass, I. et al. : Balanced active frequency multipliers for W-band signal sources, in Proc. 6th European Microwave Integrated Circuit Conf., Manchester, October 2011, 101–104.Google Scholar