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Slot coupled patch antenna in MCM-D for millimeter wave detector matrix applications

Published online by Cambridge University Press:  30 January 2012

Vahid Tavakol*
Affiliation:
Katholieke Universiteit Leuven, Kasteelpark Arenberg 10 bus 2444, B-3001 Leuven, Belgium. Phone: +32 484885390; Fax: +32 16 321986.
Feng Qi
Affiliation:
Katholieke Universiteit Leuven, Kasteelpark Arenberg 10 bus 2444, B-3001 Leuven, Belgium. Phone: +32 484885390; Fax: +32 16 321986.
Ilja Ocket
Affiliation:
Katholieke Universiteit Leuven, Kasteelpark Arenberg 10 bus 2444, B-3001 Leuven, Belgium. Phone: +32 484885390; Fax: +32 16 321986.
Dominique Schreurs
Affiliation:
Katholieke Universiteit Leuven, Kasteelpark Arenberg 10 bus 2444, B-3001 Leuven, Belgium. Phone: +32 484885390; Fax: +32 16 321986.
Walter De Raedt
Affiliation:
Imec Belgium Kapeldreef 75, B-3001 Heverlee, Belgium.
Bart Nauwelaers
Affiliation:
Katholieke Universiteit Leuven, Kasteelpark Arenberg 10 bus 2444, B-3001 Leuven, Belgium. Phone: +32 484885390; Fax: +32 16 321986.
*
Corresponding author: V. Tavakol Email: [email protected]

Abstract

In this work we assess the feasibility of fabricating a matrix of antennas for the millimeter (mm)-wave band using the “Multi Chip Module – Deposited (MCM-D)” process. The main focus of the design is to minimize the cross coupling between the antennas fabricated on the common substrate. We investigate the use of a virtual cavity formed by metalized vias in order to reduce the cross coupling to the neighboring cells. The radiation efficiency is analyzed in detail, and experimental results of a 2 × 2 array are presented.

Type
Industrial and Engineering Paper
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2012

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References

REFERENCES

[1]Sheen, D.M.; McMakin, D.L.; Hall, T.E.: Three-dimensional millimeter-wave imaging for concealed weapon detection. IEEE Trans. Microw. Theory Tech., 49 (2001), 15811592.Google Scholar
[2]Lovberg, J.A.; Martin, C.; Kolinko, Y.: Video-rate passive millimeter-wave imaging using phased arrays. In Proc. of IEEE/MTT-S Int. Microwave Symp., Honolulu, HI, June 2007, pp. 16891692.Google Scholar
[3]Ahmed, S.S.; Schiess, A.; Schmidt, L.P.: Near field mm-wave imaging with multistatic sparse 2D-arrays. In European Radar Conf., EuRAD 2009, Rome, Italy, September 30–October 2, 2009, pp. 180183.Google Scholar
[4]Posada, H.; Carchon, G.; Nauwelaers, B.; De Raedt, W.: Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules. In Proc. of Electronic Components and Technology Conf., Lake Buena Vista, FL, May 2008, pp. 20602066.Google Scholar
[5]Grzyb, J.; Troster, G.: mm-wave microstrip and novel slot antennas on low cost large area panel MCM-D substrates – a feasibility and performance study. IEEE Trans. Adv. Packag., 25 (3) (2002), 397408.Google Scholar
[6]Perfecto, E.D.; Shields, R.R.; Master, R.N.: A low cost MCM-D process for flip chip and wirebonding applications. In Electronic Components and Technology Conf., May 1995, pp. 10811086.Google Scholar
[7]Hettak, K.; Delisle, G.; Boulmalf, M.: A novel integrated antenna for millimeter-wave personal communications systems. IEEE Trans. Antennas Propag., AP-46 (1998), 17571758.CrossRefGoogle Scholar
[8]Verma, A.; Fumeaux, C.; Van-Tan, T.; Bates, B.D.: Effect of film thickness on the radiation efficiency of a 4.5 GHz polypyrrole conducting polymer patch antenna. In Microwave Conf. Proc. (APMC), 2010, Yokohama, Japan, December 7–10, 2010, pp. 9598.Google Scholar
[9]Sheen, J.: Losses of the parallel-plate dielectric resonator. IET Microw. Antennas Propag., 2 (3) (2008), 221228.CrossRefGoogle Scholar
[10]James, J.R.; Henderson, A.: High-frequency behaviour of microstrip open-circuit terminations. IEE J. Microw. Opt. Acoust., 3 (1979), 205218.Google Scholar
[11]Platt, D.; Pettersson, L.; Jakonis, D.; Salter, M.; Hagglund, J.: Integrated 79 GHz UWB automotive radar front-end based on hi-mission MCM-D silicon platform. In European Radar Conf., EuRAD 2009, Rome, Italy, September 30–October 2, 2009, pp. 445448.Google Scholar