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RF MEMS ohmic switches for matrix configurations

Published online by Cambridge University Press:  02 August 2012

Giorgio De Angelis
Affiliation:
CNR-IMM Roma, Via Fosso del cavaliere 100, 00133, Roma, Italy. Phone: +39 06 4993 4536
Andrea Lucibello
Affiliation:
CNR-IMM Roma, Via Fosso del cavaliere 100, 00133, Roma, Italy. Phone: +39 06 4993 4536
Emanuela Proietti
Affiliation:
CNR-IMM Roma, Via Fosso del cavaliere 100, 00133, Roma, Italy. Phone: +39 06 4993 4536
Romolo Marcelli*
Affiliation:
CNR-IMM Roma, Via Fosso del cavaliere 100, 00133, Roma, Italy. Phone: +39 06 4993 4536
Giancarlo Bartolucci
Affiliation:
CNR-IMM Roma, Via Fosso del cavaliere 100, 00133, Roma, Italy. Phone: +39 06 4993 4536 Department of Electronic Engineering, University of Roma “Tor Vergata”, Via del Politecnico 1, 00133 Roma, Italy
Federico Casini
Affiliation:
Department of Electronic Engineering, University of Perugia, Via G. Duranti 93, 06125 Perugia, Italy
Paola Farinelli
Affiliation:
Department of Electronic Engineering, University of Perugia, Via G. Duranti 93, 06125 Perugia, Italy
Giovanni Mannocchi
Affiliation:
THALES ALENIA SPACE Italia, Via Saccomuro 24, 00131 Roma, Italy
Sergio Di Nardo
Affiliation:
THALES ALENIA SPACE Italia, Via Saccomuro 24, 00131 Roma, Italy
Daniele Pochesci
Affiliation:
THALES ALENIA SPACE Italia, Via Saccomuro 24, 00131 Roma, Italy
Benno Margesin
Affiliation:
FBK-Center for Materials and Microsystems – Irst, Via Sommarive 18, Povo 38100, Trento, Italy
Flavio Giacomozzi
Affiliation:
FBK-Center for Materials and Microsystems – Irst, Via Sommarive 18, Povo 38100, Trento, Italy
Olivier Vendier
Affiliation:
THALES ALENIA SPACE France, Toulouse, France
Taeyoung Kim
Affiliation:
Technische Universität München, Arcisstrasse 21, 80333 München, Germany
Larissa Vietzorreck
Affiliation:
Technische Universität München, Arcisstrasse 21, 80333 München, Germany
*
Corresponding author: R. Marcelli Email: [email protected]

Abstract

Two different topologies of radio frequency micro-electro-mechanical system (RF MEMS) series ohmic switches (cantilever and clamped–clamped beams) in coplanar waveguide (CPW) configuration have been characterized by means of DC, environmental, and RF measurements. In particular, on-wafer checks have been followed by RF test after vibration, thermal shocks, and temperature cycles. The devices have been manufactured on high resistivity silicon substrates, as building blocks to be implemented in different single-pole 4-throw (SP4 T), double-pole double-throw (DPDT) configurations, and then integrated in Low Temperature Co-fired Ceramics (LTCC) technology for the realization of large-order Clos 3D networks.

Type
Research Papers
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2012

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References

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